SPRUJ40C may   2022  – may 2023

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1EVM Revisions and Assembly Variants
  5. 2System Description
    1. 2.1 Key Features
      1. 2.1.1 Thermal Compliance
      2. 2.1.2 Processor
      3. 2.1.3 Power Supply
      4. 2.1.4 Memory
      5. 2.1.5 JTAG/Emulator
      6. 2.1.6 Supported Interfaces and Peripherals
      7. 2.1.7 Expansion Connectors/Headers to Support Application Specific Add‐On Boards
    2. 2.2 Functional Block Diagram (SK-AM62 and SK-AM62B)
    3. 2.3 Functional Block Diagram (SK-AM62-P1 and SK-AM62B-P1)
    4. 2.4 AM62x SKEVM Interface Mapping
    5. 2.5 Power ON/OFF Procedures
      1. 2.5.1 Power-On Procedure
      2. 2.5.2 Power-Off Procedure
      3. 2.5.3 Power Test Points
    6. 2.6 Peripheral and Major Component Description
      1. 2.6.1  Clocking
        1. 2.6.1.1 Peripheral Ref Clock
      2. 2.6.2  Reset
      3. 2.6.3  OLDI Display Interface
      4. 2.6.4  CSI Interface
      5. 2.6.5  Audio Codec Interface
      6. 2.6.6  HDMI Display Interface
      7. 2.6.7  JTAG Interface
      8. 2.6.8  Test Automation Header
      9. 2.6.9  UART Interface
      10. 2.6.10 USB Interface
        1. 2.6.10.1 USB 2.0 Type A Interface
        2. 2.6.10.2 USB 2.0 Type C Interface
      11. 2.6.11 Memory Interfaces
        1. 2.6.11.1 DDR4 Interface
        2. 2.6.11.2 OSPI Interface
        3. 2.6.11.3 MMC Interfaces
          1. 2.6.11.3.1 MMC0 - eMMC Interface
          2. 2.6.11.3.2 MMC1 - Micro SD Interface
          3. 2.6.11.3.3 MMC2 - Wilink Interface
        4. 2.6.11.4 EEPROM
      12. 2.6.12 Ethernet Interface
        1. 2.6.12.1 CPSW Ethernet PHY 2 Default Configuration
        2. 2.6.12.2 CPSW Ethernet PHY 1 Default Configuration
      13. 2.6.13 GPIO Port Expander
      14. 2.6.14 GPIO Mapping
      15. 2.6.15 Power
        1. 2.6.15.1 Power Requirements
        2. 2.6.15.2 Power Input
        3. 2.6.15.3 Power Supply
        4. 2.6.15.4 Power Sequencing
        5. 2.6.15.5 AM62x SoC Power
        6. 2.6.15.6 Current Monitoring
      16. 2.6.16 AM62x SKEVM User Setup/Configuration
        1. 2.6.16.1 EVM DIP Switches
        2. 2.6.16.2 Boot Modes
        3. 2.6.16.3 User Test LEDs
      17. 2.6.17 Expansion Headers
        1. 2.6.17.1 PRU Connector
        2. 2.6.17.2 User Expansion Connector
        3. 2.6.17.3 MCU Connector
      18. 2.6.18 Interrupt
      19. 2.6.19 I2C Address Mapping
  6. 3Known Issues and Modifications
    1. 3.1  Issue 1 - HDMI/DSS Incorrect Colors on E1
    2. 3.2  Issue 2 - J9 and J10 Header Alignment on E1
    3. 3.3  Issue 3 - USB Boot descoped on E1
    4. 3.4  Issue 4 - OLDI Connector Orientation and Pinout
    5. 3.5  Issue 5 - Bluetooth descoped on E2 EVMs
    6. 3.6  Issue 6 - Ethernet PHY CLK Skew Default Strapping Changes
    7. 3.7  Issue 7 - TEST_POWERDOWN changes
    8. 3.8  Issue 8 - MMC1_SDCD spurious interrupts
    9. 3.9  Issue 9 - PD Controller I2C2 IRQ Not Pinned Out
    10. 3.10 Issue 10 - INA Current Monitor Adress Changes
    11. 3.11 Issue 11 - Test Automation I2C Buffer Changes
  7.   Regulatory Compliance
  8.   Revision History
2.6.11.3.2 MMC1 - Micro SD Interface

The SKEVM board provides a micro SD card interface connected to the MMC1 port of the AM62x SoC. The Micro SD card socket of Mfr. Part# MEM2051-00-195-00-A is used to interface with the MMC1 port of the AM62x SoC. UHS1 operation is supported, including IO operations at both 1.8 V and 3.3 V. The Micro SD card interface is set to operate in SD mode by default. For high-speed cards, the ROM Code of the SoC attempts to find the fastest speed that the card and controller can support and can have a transition to 1.8 V.

The SD Card connector power is provided using a load switch of Mfr. Part # TPS22918DBVR, which is controlled by ANDing the output of RESETSTATz, PORz_OUT and a GPIO from an IO Expander. An ESD protection device of part number TPD6E001RSE is provided for data, clock, and command signals. TPD6E001RSE is a line termination device with integrated TVS diodes providing system-level IEC 61000-4-2 ESD protection, ± 8-kV contact discharge and ± 15kV air-gap discharge.

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