SPRUJ54A june   2023  – july 2023

 

  1.   1
  2.   C2000 F280015x Series LaunchPad Development Kit
  3.   Trademarks
  4. 1Board Overview
    1. 1.1 Kit Contents
    2. 1.2 Features
    3. 1.3 Specifications
      1. 1.3.1 External Power Supply or Accessory Requirements
    4. 1.4 Using the F280015x LaunchPad
    5. 1.5 BoosterPacks
    6. 1.6 Hardware Revisions
      1. 1.6.1 Revision A
  5. 2Software Development
    1. 2.1 Software Tools and Packages
    2. 2.2 F280015x LaunchPad Demo Program
    3. 2.3 Programming and Running Other Software on the F280015x LaunchPad
  6. 3Hardware Description
    1. 3.1 Functional Description and Connections
      1. 3.1.1 Microcontroller
      2. 3.1.2 Power Domains
      3. 3.1.3 LEDs
      4. 3.1.4 Encoder Connectors
      5. 3.1.5 Controller Area Network (CAN)
      6. 3.1.6 Boot Modes
      7. 3.1.7 BoosterPack Sites
      8. 3.1.8 Analog Voltage Reference Header
      9. 3.1.9 Other Headers and Jumpers
        1. 3.1.9.1 USB Isolation Block
        2. 3.1.9.2 BoosterPack Site 2 Power Isolation
        3. 3.1.9.3 Alternate Power
    2. 3.2 Debug Interface
      1. 3.2.1 XDS110 Debug Probe
      2. 3.2.2 XDS110 Output
      3. 3.2.3 Virtual COM Port
    3. 3.3 Alternate Routing
      1. 3.3.1 Overview
      2. 3.3.2 UART Routing
      3. 3.3.3 EQEP Routing
      4. 3.3.4 CAN Routing
      5. 3.3.5 X1/X2 Routing
      6. 3.3.6 PWM DAC
  7. 4Board Design
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 BOM
    4. 4.4 LAUNCHXL-F2800157 Board Dimensions
  8. 5Frequently Asked Questions
  9. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design
  10. 7Revision History

3.1.2 Power Domains

The F280015x LaunchPad has several power domains that can be connected or isolated from each other with removable shunts. The different 3.3-V and 5-V power domains are described in Figure 3-2 and Figure 3-3.

GUID-20230324-SS0I-JGHJ-8H9D-WQPMRLKJX856-low.svgFigure 3-2 LaunchPad Power Distribution Diagram
GUID-20230324-SS0I-WQGS-GNLQ-XCFFVCVK7R1W-low.svgFigure 3-3 LaunchPad Power Plane Diagram

Table 3-1 describes the usage of the different removable shunts on the LaunchPad board.

Table 3-1 Power Domain Shunts
Shunt IdentifierUsage Description
JP1, +5V0Connects the +5-V power from the USB-C connector (+5V0_USB) to the +5-V power on the XDS110 side of the board (+5V0_XDS110). Bridges the power and ground isolations between the two board sides.
JP1, GNDConnects the board Ground on the isolated USB-C connector side of the board (USB_GND) to the rest of the board ground (GND). Bridges the power and ground isolations between the two board sides.
JP2, +5V0Connects the +5-V power on the XDS110 side of the board (+5V0_XDS110) to the +5-V power on the F2800157 side of the board (+5V0_MCU).
JP2, +3V3Connects the +3.3-V power on the XDS110 side of the board (+3V3_XDS110) to the +3.3-V power on the F2800157 side of the board (+3V3_MCU).