SPRUJ74 January   2023

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Key Features
    2. 1.2 Thermal Compliance
    3. 1.3 EMC, EMI, and ESD Compliance
  3. 2QP-ENET Board Identification and Installation
    1. 2.1 QP-ENET Board Component Identification
    2. 2.2 Interfacing QP-ENET Expansion Board with J784S4XG01EVM Board
      1. 2.2.1 Detailed Board Assembly Procedure (J784S4XG01EVM)
  4. 3QP-ENET Expansion Board Hardware Architecture
    1. 3.1 QP-ENET Expansion Board Hardware Top Level Diagram
    2. 3.2 Expansion Connectors
    3. 3.3 Board ID EEPROM
    4. 3.4 Ethernet Interface
      1. 3.4.1 Quad Port SGMII PHY Default Configuration
      2. 3.4.2 SGMII Clocking Scheme
        1. 3.4.2.1 Main Clock
        2. 3.4.2.2 Optional Clock
      3. 3.4.3 Ethernet Port LED Indication
      4. 3.4.4 Reset and Power-down Signals
  5. 4Revision History
  6.   A Appendix
    1.     A.1 Appendix – I (Interface Mapping)
    2.     A.2 Appendix – II (QP-ENET Board GPIO Mapping)

1.2 Thermal Compliance

There is elevated heat on the processor/heatsink: use caution, particularly at elevated ambient temperatures. Although the processor/heatsink is not a burn hazard, caution should be used when handling the EVM due to increased heat in the area of the heatsink.

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