SPRUJ85A April   2024  – August 2024

PRODUCTION DATA  

  1.   1
  2.   Description
  3. 1Key Features
  4. 2LaunchPad Module Overview
    1. 3.1 Introduction
    2. 3.2 Preface: Read This First
      1. 3.2.1 If You Need Assistance
      2. 3.2.2 Important Usage Notes
    3. 3.3 Kit Contents
    4. 3.4 Device Information
      1. 3.4.1 System Architecture Overview
      2. 3.4.2 Security
      3. 3.4.3 Compliance
      4. 3.4.4 BoosterPacks
      5. 3.4.5 Component Identification
  5. 3Hardware Description
    1. 4.1  Board Setup
      1. 4.1.1 Power Requirements
        1. 4.1.1.1 Power Input Using USB Type-C Connector
        2. 4.1.1.2 Power Status LEDs
        3. 4.1.1.3 Power Tree
      2. 4.1.2 Push Buttons
      3. 4.1.3 Boot mode Selection
      4. 4.1.4 IO Expander
    2. 4.2  Functional Block Diagram
    3. 4.3  GPIO Mapping
    4. 4.4  Reset
    5. 4.5  Clock
    6. 4.6  Memory Interfaces
      1. 4.6.1 OSPI
      2. 4.6.2 MMC
      3. 4.6.3 eMMC
      4. 4.6.4 Board ID EEPROM
    7. 4.7  Ethernet Interface
      1. 4.7.1 Ethernet PHY #1 - CPSW RGMII/ICSSM
      2. 4.7.2 Ethernet PHY #2 - CPSW RGMII/ICSSM
      3. 4.7.3 LED Indication in RJ45 Connector
    8. 4.8  I2C
    9. 4.9  Industrial Application LEDs
    10. 4.10 SPI
    11. 4.11 UART
    12. 4.12 MCAN
    13. 4.13 FSI
    14. 4.14 JTAG
    15. 4.15 TIVA and Test Automation Header
    16. 4.16 LIN
    17. 4.17 ADC and DAC
    18. 4.18 EQEP and SDFM
    19. 4.19 EPWM
    20. 4.20 BoosterPack Headers
    21. 4.21 Pinmux Mapping
  6. 4Additional Information
    1.     Trademarks
    2. 5.1 Sitara MCU+ Academy
    3. 5.2 Known Board Changes/Issues
      1. 5.2.1 OSPI DQS and LBCLK nets swap
      2. 5.2.2 XDS110 Debugger Bricking Issue
      3. 5.2.3 eMMC CMD and CLK nets swap
  7. 5References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design
  8. 6Revision History

1 Key Features

The AM263Px LaunchPad has the following features:

  • PCB dimensions: 195.56mm X 58.42mm
  • Powered through 5V, 3A USB type-C input
  • Two RJ45 Ethernet ports capable of 1Gbps speeds
  • Onboard XDS110 debug probe
  • Three push buttons:
    • PORz
    • User interrupt
    • RESETz
  • LEDs for:
    • Power status
    • Power NOT Good
    • User testing
    • Ethernet connection
    • I2C driven array
  • CAN connectivity with onboard CAN transceiver
  • Dedicated FSI connector
  • Discrete DC-DC buck regulators and LDOs that generate the required supplies with an additional option of Vpp LDO 1.7 (TLV75801PDRVR) as DNP
  • TI Test Automation Header
  • TIVA Test Automation Header
  • MMC interface to micro SD card connector. Also a footprint option for users to mount eMMC, like MTFC8GAMALBH-AT. Currently the eMMC is made DNP.
  • Two independent Enhanced Quadrature Encoder Pulse (EQEP) based encoder connectors
  • Two independent BoosterPack XL (40 pin) standard connectors featuring stackable headers to maximize expansion through the BoosterPack ecosystem
  • Onboard memory:
    • 256 Mb OSPI Flash
    • 1 Mb I2C Board ID EEPROM