SPRUJ97 June   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Key Features and Interfaces
    2. 2.2 EVM Compatibility
    3. 2.3 Assembly Instructions
    4. 2.4 Power Budget Considerations
    5. 2.5 Interfaces
      1. 2.5.1 EVM Interface
      2. 2.5.2 Sensor Interface / Coax
      3. 2.5.3 Sensor Interface / Twisted Pair
    6. 2.6 Circuit Details
      1. 2.6.1 Interface Mapping
      2. 2.6.2 I2C Address Map
      3. 2.6.3 GPIO Map
      4. 2.6.4 Identification EEPROM
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Compliance Information
    1. 4.1 Thermal Compliance
    2. 4.2 EMC, EMI, and ESD Compliance
  11. 5Additional Information
    1. 5.1 Known Hardware or Software Issues
    2. 5.2 Trademarks
  12. 6Related Documentation

3 Hardware Design Files

The hardware design files are combined into a single package and available for download at Design Files. The package file can contain multiple board revisions (directories). The naming convention is as follows for PROCxyzEwq_RP where:

- PROC: Indicates TI's Processor Product.

- xyz: Unique ID for this Evaluation Board (example is '082' for this design).

- E: E indicates Pre-Production, blank for Production.

- wq: Indicates Revision (w - Major, blank/q - Minor)

-_RP: Release Package Notation

Example (oldest to latest revision):

PROC082E1A: Pre-Production, version '1A'.

PROC082E3: Pre-Production, version '3'.

PROC082A: Production Version 'A'.

See schematic history/change log for complete list of changes for each version.