SPRUJ97 June   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Key Features and Interfaces
    2. 2.2 EVM Compatibility
    3. 2.3 Assembly Instructions
    4. 2.4 Power Budget Considerations
    5. 2.5 Interfaces
      1. 2.5.1 EVM Interface
      2. 2.5.2 Sensor Interface / Coax
      3. 2.5.3 Sensor Interface / Twisted Pair
    6. 2.6 Circuit Details
      1. 2.6.1 Interface Mapping
      2. 2.6.2 I2C Address Map
      3. 2.6.3 GPIO Map
      4. 2.6.4 Identification EEPROM
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Compliance Information
    1. 4.1 Thermal Compliance
    2. 4.2 EMC, EMI, and ESD Compliance
  11. 5Additional Information
    1. 5.1 Known Hardware or Software Issues
    2. 5.2 Trademarks
  12. 6Related Documentation

4.1 Thermal Compliance

There is opportunity for elevated heat on and near the processor or other ICs, use caution particularly at elevated ambient temperatures!

Although the devices are not burn hazards, caution must be used when handling the EVM due to increased heat in the processor area.

J7EXPA01EVM Caution

Hot surface. Contact can cause burns. Do not touch.