SPRUJC0 June   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Description
      1. 2.1.1 Functional Description and Connections
        1. 2.1.1.1  Power Domains
        2. 2.1.1.2  LEDs
        3. 2.1.1.3  Encoder Connectors
        4. 2.1.1.4  FSI
        5. 2.1.1.5  PGA
        6. 2.1.1.6  CAN
        7. 2.1.1.7  CLB
        8. 2.1.1.8  Boot Modes
        9. 2.1.1.9  BoosterPack Sites
        10. 2.1.1.10 Analog Voltage Reference Header
        11. 2.1.1.11 Other Headers and Jumpers
          1. 2.1.1.11.1 USB Isolation Block
          2. 2.1.1.11.2 BoosterPack Site 2 Power Isolation
          3. 2.1.1.11.3 Alternate Power
      2. 2.1.2 Debug Interface
        1. 2.1.2.1 XDS110 Debug Probe
        2. 2.1.2.2 XDS110 Output
        3. 2.1.2.3 Virtual COM Port
      3. 2.1.3 Alternate Routing
        1. 2.1.3.1 Overview
        2. 2.1.3.2 UART Routing
        3. 2.1.3.3 EQEP Routing
        4. 2.1.3.4 CAN Routing
        5. 2.1.3.5 PGA Routing
        6. 2.1.3.6 FSI Routing
        7. 2.1.3.7 X1/X2 Routing
        8. 2.1.3.8 PWM DAC
    2. 2.2 Using the F28P55x LaunchPad
    3. 2.3 BoosterPacks
    4. 2.4 Hardware Revisions
      1. 2.4.1 Revision A
  9. 3Software
    1. 3.1 Software Development
      1. 3.1.1 Software Tools and Packages
      2. 3.1.2 F28P55x LaunchPad Demo Program
      3. 3.1.3 Programming and Running Other Software on the F28P55x LaunchPad
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 LAUNCHXL-F28P55X Board Dimensions
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Frequently Asked Questions
    2. 5.2 Trademarks
  12. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design

2.4.1 Revision A

The first production revision of the LAUNCHXL-F28P55X was released in February 2023. This revision can be identified by the MCU133A silkscreen labeling on the back side of the EVM between the BoosterPack Connector site 1 towards the top of the board.

Issues and concerns that have been identified on the EVM are listed below:

Known issues:

  • No issues to report at this time of initial release.

Special notes and considerations to be aware of:

  • Some of the F28P55X LaunchPads come with indicated "EQEP2" label on the silkscreen instead of "EQEP3" one. Beware that EQEP2 on the silkscreen corresponds to the EQEP3 module.