SPRUJD8 June   2024 TDA4APE-Q1 , TDA4VPE-Q1

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
    4. 1.4 Specification
  8. 2Hardware
    1. 2.1 Key Features and Interfaces
    2. 2.2 Power On/Off Procedure
    3. 2.3 Power Input
      1. 2.3.1 Power Supply
      2. 2.3.2 Power Control
      3. 2.3.3 Power Budget Considerations
    4. 2.4 User Inputs and Settings
      1. 2.4.1 Boot Configuration Settings
      2. 2.4.2 Board Configuration Settings
      3. 2.4.3 Reset Pushbuttons
      4. 2.4.4 User Pushbuttons
    5. 2.5 Standard Interfaces
      1. 2.5.1 Audio Input and Output
      2. 2.5.2 Display Port Interfaces
      3. 2.5.3 Gigabit Ethernet
      4. 2.5.4 JTAG/Emulation Interface
      5. 2.5.5 MicroSD Card Cage
      6. 2.5.6 PCIe Card Slot
      7. 2.5.7 UARTs for Terminal/Logging
      8. 2.5.8 USB Interface
    6. 2.6 Expansion Interfaces
      1. 2.6.1 Accessory Power Connector
      2. 2.6.2 Analog-to-Digital Conversion
      3. 2.6.3 Camera Interface
      4. 2.6.4 CAN-Bus Interface
      5. 2.6.5 Fan Header
      6. 2.6.6 LIN-Bus Interface
      7. 2.6.7 Test and Automation Control Interface
    7. 2.7 Circuit Details
      1. 2.7.1 Interface Mapping
      2. 2.7.2 Shared Interfaces / Signal Muxing
      3. 2.7.3 I2C Address Mapping
      4. 2.7.4 GPIO Mapping
      5. 2.7.5 Power Monitoring
      6. 2.7.6 Power Delivery Network (PDN)
      7. 2.7.7 Identification EEPROM
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Compliance Information
    1. 4.1 EMC, EMI, and ESD Compliance
    2. 4.2 Reach Compliance
    3. 4.3 Thermal Compliance
  11. 5Additional Information
    1. 5.1 Known Hardware or Software Issues
    2. 5.2 Trademarks

4.3 Thermal Compliance

There is opportunity for elevated heat on or near the processor or heat sink, use caution particularly at elevated ambient temperatures. Although the processor or heat sink is not a burn hazard, caution must be used when handling the EVM due to increased heat in the area of the heat sink.

CAUTION:
J742S2XH01EVM Caution Hot surface. Contact can cause burns. Do not touch.