This document describes the silicon updates to the functional specifications for the TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320C2802, TMS320C2801, TMS320F28016, and TMS320F28015 digital signal processors (DSPs).

The updates are applicable to:

• 100-ball MicroStar BGA™, GGM, ZGM, GBA, and NMF suffix
• 100-pin thin quad flatpack, PZ suffix

Throughout this document, the device names are abbreviated as follows:

• F280x or TMS320F280x refers to TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802 and TMS320F2801 silicon
• C280x or TMS320C280x refers to TMS320C2802 and TMS320C2801 silicon.
• F2801x or TMS320F2801x refers to TMS320F28016 and TMS320F28015 silicon.

Throughout this document, any reference to F2801 and F2802 devices includes both 60-MHz and 100-MHz versions.

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all [TMS320] DSP devices and support tools. Each TMS320™ DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, TMS320F2808). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).

Support tool development evolutionary flow:

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."

TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, GBA) and temperature range (for example, A).

Figure 3-1 provides an example of the TMS320F280x device markings and defines each of the markings. The device revision can be determined by the symbols marked on the top of the package as shown in Figure 3-1. Some prototype devices may have markings different from those illustrated. Figure 3-2 shows an example of device nomenclature.

Figure 3-1 Example of Device Markings

Figure 3-2 Example of Device Nomenclature

Table 4-1 to Table 4-3 list the change(s) made to each silicon revision.