SPRZ357P August   2011  – June 2020 F28M35E20B , F28M35H22C , F28M35H52C , F28M35H52C-Q1 , F28M35M22C , F28M35M52C

 

  1.   F28M35x Concerto MCUs Silicon Errata Silicon Revisions E, B, A, 0
    1. 1 Introduction
    2. 2 Device and Development Support Tool Nomenclature
    3. 3 Device Markings
    4. 4 Usage Notes and Known Design Exceptions to Functional Specifications
      1. 4.1 Usage Notes
        1. 4.1.1  PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
        2. 4.1.2  FPU32 and VCU Back-to-Back Memory Accesses
        3. 4.1.3  Caution While Using Nested Interrupts
        4. 4.1.4  PBIST: PBIST Memory Test Feature is Deprecated
        5. 4.1.5  HWBIST: Cortex-M3 HWBIST Feature is Deprecated
        6. 4.1.6  HWBIST: C28x HWBIST Feature Support is Restricted to TI-Supplied Software
        7. 4.1.7  Flash Tools: Device Revision Requires a Flash Tools Update
        8. 4.1.8  EPI: New Feature Addition to EPI Module
        9. 4.1.9  EPI: ALE Signal Polarity
        10. 4.1.10 EPI: CS0/CS1 Swap
        11. 4.1.11 Major Device Revision
      2. 4.2 Known Design Exceptions to Functional Specifications
    5. 5 Documentation Support
  2.   Trademarks
  3.   Revision History

1 Introduction

This document describes the silicon updates to the functional specifications for the F28M35x microcontrollers (MCUs).

The updates are applicable to:

  • 144-pin PowerPAD™ Thermally Enhanced Thin Quad Flatpack, RFP Suffix