SPRZ362F November   2012  – October 2021 TMS320F28050 , TMS320F28051 , TMS320F28052 , TMS320F28052-Q1 , TMS320F28052F , TMS320F28052F-Q1 , TMS320F28052M , TMS320F28052M-Q1 , TMS320F28053 , TMS320F28054 , TMS320F28054-Q1 , TMS320F28054F , TMS320F28054F-Q1 , TMS320F28054M , TMS320F28054M-Q1 , TMS320F28055

 

  1. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  2. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  3. 3Silicon Revision A Usage Notes and Advisories
    1. 3.1 Silicon Revision A Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear Usage Note
      2. 3.1.2 CAN Bootloader: Internal Oscillator Tolerance is Not Sufficient for CAN Operation at High Temperatures
    2. 3.2 Silicon Revision A Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
  4. 4Silicon Revision 0 Usage Notes and Advisories
    1. 4.1 Silicon Revision 0 Usage Notes
    2. 4.2 Silicon Revision 0 Advisories
  5. 5Documentation Support
  6. 6Trademarks
  7. 7Revision History

3.1.2 CAN Bootloader: Internal Oscillator Tolerance is Not Sufficient for CAN Operation at High Temperatures

Revision(s) Affected: 0, A

The CAN bootloader in the device's boot ROM uses the internal oscillator as the source for the CAN bit clock. At high temperatures, the frequency of the internal oscillator can deviate enough to prevent messages from being received.

Workaround: Recalibrate the internal oscillator before invoking the CAN bootloader. This can be done in application code. For more flexibility, a wrapper function may be programmed into the device's OTP memory. See the Using the Piccolo™ CAN Bootloader at High Temperature Application Report for details on how to implement this workaround.