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How Innovative Packaging Can Drive Higher Power Density in Load Switches
SSZT096
february 2022
TPS22964C
,
TPS22975
,
TPS22992
,
TPS22998
CONTENTS
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How Innovative Packaging Can Drive Higher Power Density in Load Switches
1
2
3
Wafer Chip-scale Packaging (WCSP)
Plastic Packaging with Wire-bond Technology
Plastic HotRod™ Package
Conclusion
Additional Resources
IMPORTANT NOTICE
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How Innovative Packaging Can Drive Higher Power Density in Load Switches
