SWRA672 May   2020 AWR6843AOP , IWR6843AOP

 

  1.   Thermal Design Guide for Antenna on Package mmWave Sensor
    1.     Trademarks
    2. 1 Introduction
    3. 2 mmWave AoP package
      1. 2.1 Thermal Characteristics of the Package
    4. 3 Salient features of AoP EVM
      1. 3.1 Thermal Challenges in Dissipating the Heat
    5. 4 Techniques for Mitigating the Heat Dissipation
      1. 4.1 Reduce the System Level Thermal Resistance
      2. 4.2 Board Size Scaling
      3. 4.3 Heatsink Options
        1. 4.3.1 Sheet Metal Heat Sink
        2. 4.3.2 Heat Sink Details
        3. 4.3.3 Mounting Options
        4. 4.3.4 Thermal Characteristics With the Sheet-Metal Heatsink
      4. 4.4 Heatsink with fins
        1. 4.4.1 Thermal Characteristics With the Heatsink
    6. 5 PCB based thermal improvements
      1. 5.1 Thermal via array
    7. 6 Application and Demos
    8. 7 Summary
    9. 8 Acknowledgment
    10. 9 References

4.3.2 Heat Sink Details

Figure 7 shows an example of the low-cost heatsink made developed using sheet metal. This is mainly designed for AoP EVM. This could be customized depending upon your needs and the desired system level thermal resistance target.

Heat_sink_dimensions.pngFigure 7. Sheet Metal Dimensional Details
Heat_sink_image.pngFigure 8. Sheet Metal Heat-Sink Used in the Form-Factor EVM