SWRA672 May   2020 AWR6843AOP , IWR6843AOP

 

  1.   Thermal Design Guide for Antenna on Package mmWave Sensor
    1.     Trademarks
    2. 1 Introduction
    3. 2 mmWave AoP package
      1. 2.1 Thermal Characteristics of the Package
    4. 3 Salient features of AoP EVM
      1. 3.1 Thermal Challenges in Dissipating the Heat
    5. 4 Techniques for Mitigating the Heat Dissipation
      1. 4.1 Reduce the System Level Thermal Resistance
      2. 4.2 Board Size Scaling
      3. 4.3 Heatsink Options
        1. 4.3.1 Sheet Metal Heat Sink
        2. 4.3.2 Heat Sink Details
        3. 4.3.3 Mounting Options
        4. 4.3.4 Thermal Characteristics With the Sheet-Metal Heatsink
      4. 4.4 Heatsink with fins
        1. 4.4.1 Thermal Characteristics With the Heatsink
    6. 5 PCB based thermal improvements
      1. 5.1 Thermal via array
    7. 6 Application and Demos
    8. 7 Summary
    9. 8 Acknowledgment
    10. 9 References

2.1 Thermal Characteristics of the Package

For the most updated numbers on the thermal characteristics of the package, see the Thermal Resistance Characteristics section in the device-specific data sheet. This thermal characteristic would be helpful in performing thermal simulation at a system level. You need to include thermal models of other components in the system such as PMIC, Flash, Heatsink and any other associated components including PCB characteristics.

From the thermal simulations, you could arrive at the right thermal dissipation profile keeping junction temperature of the device under safe operating limits (a maximum of 105°C for Industrial grade and 125°C for automotive grade applications). This also helps in arriving at the right system level thermal resistance needed for the application.

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.