SWRA680 November   2020 CC3100 , CC3120 , CC3135 , CC3200 , CC3220R , CC3220S , CC3220SF , CC3235S , CC3235SF

 

  1.   Abstract
  2.   Trademarks
  3. 1Crystal Oscillator Basics
    1. 1.1 Crystal Oscillator Model
  4. 2Crystal Selection
    1. 2.1 Crystal Mode of Operation
    2. 2.2 Temperature Tolerance
    3. 2.3 Aging (Long-Term Stability)
    4. 2.4 Crystal ESR
    5. 2.5 Frequency Accuracy
    6. 2.6 Drive Level
    7. 2.7 Selecting a crystal
      1. 2.7.1 Crystal Specifications
      2. 2.7.2 Recommended Crystals for the CC31xx and CC32xx
  5. 3Crystal Tuning
    1. 3.1 The importance of Crystal Tuning
    2. 3.2 Load Capacitance
    3. 3.3 Crystal Tuning With CL
  6. 4Measuring the ppm Error for the Fast Clock (High Frequency)
    1. 4.1 Setting Up for the CC3x00 Devices
    2. 4.2 Setting Up for the CC3x20 and CC3x35 Devices
    3. 4.3 Measuring ppm Frequency Error
  7. 5PCB Layout Guidelines
    1. 5.1 The 32.768-kHz Crystal (Slow Clock)
    2. 5.2 The 40-MHz Crystal (Fast Clock)
  8. 6References

3 Crystal Tuning

Based on the PCB trace capacitance and the crystal used on the final product, the shunt caps on the crystal may need to be adjusted in order to make sure the net capacitance load is exactly what is required.

The devices require two separate clocks for its operation:

  • A slow clock running at 32.768 kHz which is used for the RTC.
  • A fast clock running at 40 MHz that is used by the device for the internal processor and the WLAN subsystem.