The TI Wi-SUN® software overview describes the overall Wi-SUN® FAN software content and supporting ecosystem from Texas Instruments based on the TI Wi-SUN® FAN 1.0 implementation. The document provides a high level overview of the features and capabilities of the Wi-SUN® FAN software without specific details. For further information on APIs and implementation details, see the Wi-SUN® Developers Guide and the SIMPLELINK-LOWPOWER-F2-SDK.
LaunchPad™, and SimpleLink™Code Composer Studio are trademarks of Texas Instruments.
Wi-SUN® is a registered trademark of Wi-SUN Alliance.
Microsoft® and Windows® are registered trademarks of Microsoft Corporation.
Linux® is a registered trademark of Linus Torvalds.
macOS® is a registered trademark of Apple Inc..
All trademarks are the property of their respective owners.
This product overview uses the following acronyms:
Wi-SUN® is a standards-based mesh network with frequency hopping. The Wi-SUN® Alliance (wi-sun.org) has more than 300 members from 46 countries, with 100M+ devices deployed world-wide. Wi-SUN® supports IPv6 protocol suite and standards based multilayer security. The standard supports multiple data rates and frequency bands to meet different regulatory requirements world-wide. Applications include smart grid and smart city applications, with certified products enabling multi-vendor interoperability.
TI's Wi-SUN® FAN v1.0.0 design is based on the open source IETF RFC components integrated on top of the Wi-SUN® compliant TI 15.4 Stack. A Network Interface Model is provided based on an open-source SPINEL interface. Customers typically develop their application on top of IPv6 using UDP as the transport layer.
TI's Wi-SUN® FAN v1.0.0 design is optimized for a small memory footprint to fit embedded devices, in addition to optimizations for low-power operation. Integration and testing of the software stack is done in tagged, certified releases.
Component | Version |
---|---|
TI Wi-SUN® release | v1.0.0 |
Distribution | Included in SDK7.10 for CC13x2 and CC13x4 devices as library code |
IDE support | CCS v 12.5 for Microsoft® Windows® 10, Linux®, and macOS® |
Compiler support | TI Clang 2.1 LTS |
RTOS support | TI-RTOS, Free RTOS |
Supported devices | Border router: CC1312R7, CC1352P7, CC1314R10, CC1354R10, CC1354P10 Router nodes: CC1312R, CC1312PSIP, CC1352R, CC1352P, CC1312R7, CC1352P7, CC1314R10, CC1354R10, CC1354P10 |
Recommended development kits | Border router: Personal Computer (PC) host + CC1352P7 LaunchPad™ Development Kit or CC1354P10 LaunchPad™ Router nodes: CC1352P LaunchPad™ or CC1354P10 LaunchPad™ |
TI has certified multiple FAN profiles with the Wi-SUN® Alliance to be used on CC13x2x as well as CC13x4x10 devices. Not every devices support all of the FAN profiles due to constraints of the internal memory of the device. Table 2 lists the Wi-SUN® FAN profiles with the corresponding certificate and the certificate for the PHYs that can be used with the respective device.
Wi-SUN® Certificate | FAN profile | Corresponding PHYs |
---|---|---|
WSA0272 | FAN profile (router) for CC13x2R or CC13x2P | WSA0260 WSA0262 (800MHz) |
WSA0273 | FAN profile (router) for CC13x2R7 or CC13x2P7 | WSA0261 WSA0263 (800MHz) |
WSA0278 | FAN profile (border router) for CC13x2R7 or CC13x2P7 | WSA0261 WSA0263 (800MHz) |
WSA0313 | FAN profile (router) for CC13x4R10 or CC13x4P10 | WSA0311 WSA0312 |
WSA0314 | FAN profile (border router) for CC13x4R10 or CC13x4P10 | WSA0311 WSA0312 |
The SimpleLink™ SDK incorporates a number of examples for the different roles in a Wi-SUN® FAN. Not every role and example is available for every device. This is due to the memory requirements of some roles. Lower memory devices are therefore not be able to be used as a border router role. A list of examples with the corresponding capable devices is listed in Table 3 and Table 4.
Application | Usage |
---|---|
Python interface module for NWP | Reference code to control a NWP from a Linux or Microsoft® Windows® 10 PC. Public on TI GitHub |
Border router in NWP configuration | Border router controlled over UART with TI-defined API (based on SPINEL interface layer). |
Router in NWP configuration | Router node controlled over UART with TI defined API (based on SPINEL interface layer). |
Embedded router example | Single chip router example with embedded CoAP server |
Embedded router with off-chip OAD capability | Single chip router example with embedded CoAP server and off-chip over-the-air-download capability (for CC13x2x7 devices) |
Embedded router with on-chip OAD capability | Single chip router example with embedded CoAP server and on-chip over-the-air-download capability (for CC13x4x10 devices) |
Code Example and Wireless MCU | SDK Example Designation | Available FLASH | Available RAM | Comments |
---|---|---|---|---|
NWP border router on CC1312R7 or CC1352P7 | ns_br | 309kB (44%) | 21kB (15%) | The user is not expected to add code to the NWP image. Only board-level configuration is done by user. |
NWP border router on CC1314R10 or CC1354R10 | ns_br | 633kB | 134kB | |
NWP router on CC1312R or CC1352P | ns_node | 15kB(1) (5%) | 14kB(1) (19%) | |
Embedded router on CC1312R7 or CC1352P7 (CoAP based) | ns_coap_node | 380kB (54%) | 88kB (61%) | — |
Embedded router on CC1314R10 or CC1354R10 (CoAP based) | ns_coap_node | 704kB | 201kB | — |
OAD off-chip on CC1312R7 or CC1352P7 (CoAP based) | ns_coap_oad_offchip | 380kB | 88kB | — |
OAD on-chip on CC1314R10 or CC1354R10 (CoAP based) | ns_coap_oad_onchip | 364kB | 201kB | 352kB flash memory reserved for OAD image |
The memory footprint is based on using the TIRTOS7 and TICLANG compiler. It is possible that the footprint varies when using FreeRTOS or another compiler.