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Acronym | Definition |
---|---|
DC | Direct Current |
EM | Evaluation Module |
ETSI | European Telecommunications Standards Institute |
FCC | Federal Communications Commission |
FR4 | Material type used for producing PCB |
ISM | Industrial, Scientific, Medical |
LC | Inductor (L) Capacitor (C) configuration |
ML | Multi-Layer Inductor |
NM | Not Mounted |
PCB | Printed Circuit Board |
SoC | System on Chip |
SRD | Short Range Devices |
WW | Wire-Wound Inductor |
PA | Power Amplifier |
IPC | Integrated Passive Component |
The existing reference designs for the 10 dBm PA 2.4 GHz are based upon LAUNCHXL-CC2652P [7] and LAUNCHXL-CC1352P-4 [6], these are based upon passive discrete components, refer to Figure 1-1.
Each RF port is terminated with 50-ohm impedance that can be connected to SMA connector, switch or diplexer. The main advantage in using a switch or diplexer is a common RF port instead of several RF ports.
LAUNCHXL-CC2652P [4] has two RF ports and LAUNCHXL-CC1352P-4 [5] has three RF ports. The additional RF port in CC1352P can be configured for both Sub-1 GHz or 2.4 GHz. The PA port of CC2652P [1] and CC1352P [2] can be configured as 20 dBm or 10 dBm. The PA IPC [3] can be used for 10 dBm, 2.4 GHz for both CC26x2P [1] and CC1352P [2]
This application note will document the measurements performed on the PA Tx port for CC2652P [1] and CC1352P [2] for 10 dBm 2.4 GHz with the IPC [3] component. The parts in the reference design not related to the PA port will not be discussed.
A switch (SPDT for CC2652P and SP3T for CC1352P) is used on the LaunchPads [5] to enable a common RF port which is connected to an integrated PCB dual-band antenna.