SWRA786 july 2023 CC2674P10 , CC2674R10
The CC2674R10 is a Core CPU and memory upgrade of the CC26x2R1 and CC26x2R7 devices. The CC2674R10 device features an Arm®Cortex®-M33 processor core and has 256 kB of RAM and 1024 kB of Flash. The CC2674R10 has two package options that have different hardware migration paths.
RGZ package 7×7 mm:
For this package, the two devices are pin to pin compatible and a PCB design made for the CC26x2R1 or CC26x2R7 devices can be reused for the CC2674R10 device.
For applications requiring a slow clock accuracy of < ±500 PPM (such as Bluetooth® Low Energy applications), an external 32 kHz slow clock is required for use with the CC2674R10 device. For details, see the Clock Accuracies and Bluetooth LE section of the SimpleLink™ CC13xx CC26xx SDK BLE5-Stack User's Guide. The only other update to the Bill of Materials (BOM) required is the wireless MCU itself.RGZ package 8×8 mm:
For this package, the two devices are physically different and a PCB design made for the CC26x2R1 or CC26x2R7 device has to be redesigned for the CC2674R10 device.
Main differences:
For more information, use the LP-EM-CC1354P10-6 Design Files and the packaging information section of the CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier Data Sheet as references.
The LP-EM-CC1354P10-6 contains two 2.4 GHz paths and one Sub-1 GHz RF path. To adapt the design to the CC2674R10 device, simply remove the parts and PCB routing of both the 2.4 GHz 10 dBm and the Sub-1 GHz 14 dBm RF paths.
For applications requiring a slow clock accuracy of < ±500 PPM (such as Bluetooth Low Energy applications), an external 32 kHz slow clock is required for use with the CC2674R10 device. For details, see the Clock Accuracies and Bluetooth LE section of the SimpleLink™ CC13xx CC26xx SDK BLE5-Stack User's Guide.