The integration of LoP technology
enables multiple benefits:
- Performance Advantage: TI
LoP enables lower transition power loss as the MMIC-to-antenna transition is
through a PCB waveguide. This enables an SNR advantage at the sensor level when
compared to conventional package and resulting in a higher maximum range for
same angular resolution and FOV. Additionally, more stable performance from 3D
antennas across channels is achieved compared to microstrip patch antenna.
- Thermal management: TI LoP
technology which has the launches on the bottom side of the package enables
thermal management at the top side as a provision for top side heat sink.
- Emissions Advantage: TI
LoP with the launches on the bottom side of the package enables lower EMI/C
issues as 3D antenna is placed on one side of the PCB and mmWave integrated chip
is on the other side of the PCB, thereby increasing isolation from the MMIC to
the 3D antenna.
- Cost and Size Advantage:
TI LoP technology enables a cost advantage at the sensor level due to PCB
material and size. PCB cost savings are enabled by the ability to use
inexpensive PCB material. Additional PCB cost savings can be achieved as no
micro vias are needed. The potential number of PCB ground layers can also be
reduced, thereby reducing in total number of PCB layers.
- Flexibility: LoP with
external 3D antenna enables better PCB reuse across multiple sensors designs as
the waveguide antenna can be changed for multiple sensors that have different
field of view. Radar sensors with fewer PCB variants can be designed, enabling
higher volume during production, thereby reducing logistics and cost. Moreover,
a wider selection of PCB suppliers is available in market due for non-premium RF
substrates.
Thus, by minimizing signal loss and
optimizing integration, TI LoP technology contribute significantly to the efficiency
and reliability of mmWave radar chips. The compact design facilitated by TI LoP
technology provides seamless incorporation into automotive radar systems.