SWRA814 May   2024 CC1311P3 , CC1311R3 , CC1312R , CC1312R7 , CC1314R10 , CC1352P , CC1352P7 , CC1352R , CC1354P10 , CC1354R10

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2CC131x and CC135x Device Family Comparison
    1. 2.1 Device Naming
      1. 2.1.1 Frequency Band
      2. 2.1.2 Generation, Sub-1GHz and Multi-band
      3. 2.1.3 Protocols
      4. 2.1.4 Major Features
      5. 2.1.5 Radio Output Power
      6. 2.1.6 Memory Size
    2. 2.2 Available RF Outputs
    3. 2.3 Device Package Size
      1. 2.3.1 Pin-to-Pin Compatibility
      2. 2.3.2 Package Size and Reference Design
      3. 2.3.3 Available GPIO Count
    4. 2.4 SMD Component Package Size
    5. 2.5 Crystal Oscillator
      1. 2.5.1 Applications Requiring a Slow Clock Accuracy
      2. 2.5.2 Internal Variable Load Capacitor Array
    6. 2.6 Memory
    7. 2.7 Summary Table
  6. 3Device-to-Device Migration Considerations
    1. 3.1 Sub1-GHz Devices
      1. 3.1.1 Migrating from CC1310 to CC131xRx or CC1311P3
      2. 3.1.2 Migrating from CC1312Rx to CC1311R3 or CC1314R10
      3. 3.1.3 Migrating from CC131xRx to CC1311P3
    2. 3.2 Multi-Band Devices
      1. 3.2.1 Migrating from CC1350 to CC135xRx or CC135xPx
      2. 3.2.2 Migrating from CC1352R to CC1354R10
      3. 3.2.3 Migrating from CC135xRx to CC135xPx
      4. 3.2.4 Migrating from CC1352Px to CC1354P10
  7. 4Summary
  8. 5References
    1. 5.1 Recommended Resources
    2. 5.2 Device Data Sheets

SMD Component Package Size

The selected SMD component package size is an important factor for the RF path and checking the component size in the reference design is vital. This information is typically found in the Bill of Materials (BOM) included with the reference design.

Using the incorrect component package size with a chosen reference design results in degraded performance. Specific details about hardware design considerations for the RF path are found in the application note, CC13xx/CC26xx Hardware Configuration and PCB Design Considerations.

Currently, the TI reference designs use component package size 0402 or 0201 in the RF path. Use the imperial size code (inches) when referring to component package sizes in this document.

When a TI reference design does not exist for a given component package size, using 0201 or 0402 components in a design can produce the same RF radio performance if the RF path is re-optimized to account for the change in the impedance presented to the RF port (that results from using a different component size).

Note: A common mistake is using the values for one component package size (0201 or 0402) with a design that was designed using the other component package size. This mistake results in reduced RF performance.

Using 0201 package size components have the following advantages compared to 0402 package size components:

  • More compact RF layout
  • Tighter component tolerances available
  • The more compact RF layout results in lower unwanted EMI emissions
  • Generally cheaper than the equivalent 0402 package size components

Reference designs for devices, CC13x1, CC13x2P7, and CC13x4, use 0201 package size components, while devices CC13x0 and CC13x2 use 0402 or 0201, depending on the design and the component package size used, therefore, package size components must be checked as part of the design process.

Note:
  • A PCB designed for a 0402 component package size can be reused if migrating from a pin-to-pin compatible CC1310 RGZ (7mm × 7mm) VQFN variant (see Section 2.3.1), only requiring that the crystal is changed (detailed in Section 2.5).
  • The RF path for the CC13x1R3, CC13x2Rx, and CC13x4Rx devices can be unchanged when migrating to another device with the same package size if the Sub-1GHz BOM uses 0402 components from an existing RGZ (7mm × 7mm) VQFN design.
  • +20dBm reference designs likely use a 0201 component package size, therefore, TI recommends switching to a 0201 component package size if migrating to a P device to avoid two different package sizes for the Sub-1GHz and +20dBm PA RF paths.

The primary reference designs and the component package sizes used are listed in Table 2-11.

Table 2-11 Reference Design and Component Package Size Used
Component Package Size (Inches) Reference Design
0201 LP-CC1312R7
LP-EM-CC1314R10
LP-CC1311P3
LAUNCHXL-CC1352P1
LAUNCHXL-CC1352P-2
LAUNCHXL-CC1352P-4
LP-CC1352P7-1
LP-CC1352P7-4
LP-CC1354P10-1
0402 LAUNCHXL-CC1310
LAUNCHXL-CC13-90
All other CC1310 designs
LAUNCHXL-CC1312R1
CC1312REM-XD7793
LAUNCHXL-CC1352R1
CC1352PEM-XD7793-XD24-PA9093
CC1352PEM-XD7793-XD24-PA24
CC1352-P7EM-XD7793-XD24-PA24
CC1352-P7EM-XD7793-XD24-PA24_10dBm
CC1352-P7EM-XD7793-XD24-PA9093