SWRS257
March 2022
CC2651P3
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Revision History
6
Device Comparison
7
Pin Configuration and Functions
7.1
Pin Diagram – RGZ Package (Top View)
7.2
Signal Descriptions – RGZ Package
7.3
Pin Diagram – RKP Package (Top View)
7.4
Signal Descriptions – RKP Package
7.5
Connections for Unused Pins and Modules
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Power Supply and Modules
8.5
Power Consumption - Power Modes
8.6
Power Consumption - Radio Modes
8.7
Nonvolatile (Flash) Memory Characteristics
8.8
Thermal Resistance Characteristics
8.9
RF Frequency Bands
8.10
Bluetooth Low Energy - Receive (RX)
8.11
Bluetooth Low Energy - Transmit (TX)
8.12
Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
8.13
Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
8.14
Timing and Switching Characteristics
8.14.1
Reset Timing
8.14.2
Wakeup Timing
8.14.3
Clock Specifications
8.14.3.1
48 MHz Crystal Oscillator (XOSC_HF)
8.14.3.2
48 MHz RC Oscillator (RCOSC_HF)
8.14.3.3
32.768 kHz Crystal Oscillator (XOSC_LF)
8.14.3.4
32 kHz RC Oscillator (RCOSC_LF)
8.14.4
Synchronous Serial Interface (SSI) Characteristics
8.14.4.1
Synchronous Serial Interface (SSI) Characteristics
37
8.14.5
UART
8.14.5.1
UART Characteristics
8.15
Peripheral Characteristics
8.15.1
ADC
8.15.1.1
Analog-to-Digital Converter (ADC) Characteristics
8.15.2
DAC
8.15.2.1
Digital-to-Analog Converter (DAC) Characteristics
8.15.3
Temperature and Battery Monitor
8.15.3.1
Temperature Sensor
8.15.3.2
Battery Monitor
8.15.4
Comparator
8.15.4.1
Continuous Time Comparator
8.15.5
GPIO
8.15.5.1
GPIO DC Characteristics
8.16
Typical Characteristics
8.16.1
MCU Current
8.16.2
RX Current
8.16.3
TX Current
8.16.4
RX Performance
8.16.5
TX Performance
8.16.6
ADC Performance
9
Detailed Description
9.1
Overview
9.2
System CPU
9.3
Radio (RF Core)
9.3.1
Bluetooth 5.2 Low Energy
9.3.2
802.15.4 (Zigbee and 6LoWPAN)
9.4
Memory
9.5
Cryptography
9.6
Timers
9.7
Serial Peripherals and I/O
9.8
Battery and Temperature Monitor
9.9
µDMA
9.10
Debug
9.11
Power Management
9.12
Clock Systems
9.13
Network Processor
10
Application, Implementation, and Layout
10.1
Reference Designs
11
Device and Documentation Support
11.1
Device Nomenclature
11.2
Tools and Software
11.2.1
SimpleLink™ Microcontroller Platform
11.3
Documentation Support
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
8.16.5
TX Performance
Figure 8-21
Output Power vs. Temperature (BLE 1 Mbps, 2.44 GHz)
Figure 8-23
Output Power vs. Temperature (BLE 1 Mbps, 2.44 GHz, +20 dBm PA)
Figure 8-25
Output Power vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)
Figure 8-27
Output Power vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +20 dBm PA)
Figure 8-29
Output Power vs. Frequency (BLE 1 Mbps, 2.44 GHz)
Figure 8-31
Output Power vs. Frequency (BLE 1 Mbps, 2.44 GHz, +20 dBm PA)
Figure 8-22
Output Power vs. Temperature (BLE 1 Mbps, 2.44 GHz, +5 dBm)
Figure 8-24
Output Power vs. Temperature (2.44 GHz, +10 dBm PA)
Figure 8-26
Output Power vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +5 dBm)
Figure 8-28
Output Power vs. Supply Voltage (VDDS) (2.44 GHz, +10 dBm PA)
Figure 8-30
Output Power vs. Frequency (BLE 1 Mbps, 2.44 GHz, +5 dBm)
Figure 8-32
Output Power vs. Frequency (250 kbps, +10 dBm PA)