SWRS257 March   2022 CC2651P3

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RKP Package (Top View)
    4. 7.4 Signal Descriptions – RKP Package
    5. 7.5 Connections for Unused Pins and Modules
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.14.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparator
        1. 8.15.4.1 Continuous Time Comparator
      5. 8.15.5 GPIO
        1. 8.15.5.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee and 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX

Measured on the CC26x1-P3EM-7XD24-PA24 reference design with Tc = 25 °C, VDDS = 3.0 V, fRF= 2440 MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection.
All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Receiver sensitivity Differential mode PER = 1% –100 dBm
Receiver sensitivity Single-Ended mode. Measured on CC26x1-P3EM-5XS24 at the SMA connector. PER = 1% -99 dBm
Receiver saturation PER = 1% > 5 dBm
Adjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1% 36 dB
Alternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1% 57 dB
Channel rejection, ±15 MHz or more Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1%
59 dB
Blocking and desensitization,
5 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 57 dB
Blocking and desensitization,
10 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB
Blocking and desensitization,
20 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB
Blocking and desensitization,
50 MHz from upper band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 66 dB
Blocking and desensitization,
–5 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 60 dB
Blocking and desensitization,
–10 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 60 dB
Blocking and desensitization,
–20 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB
Blocking and desensitization,
–50 MHz from lower band edge
Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB
Spurious emissions, 30 MHz to 1000 MHz Measurement in a 50-Ω single-ended load(1) –66 dBm
Spurious emissions, 1 GHz to 12.75 GHz Measurement in a 50-Ω single-ended load(1) –53 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > 350 ppm
Symbol rate error tolerance Difference between incoming symbol rate and the internally generated symbol rate > 1000 ppm
RSSI dynamic range 95 dB
RSSI accuracy ±4 dB
Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66