Wireless microcontroller
Ultra-low power sensor controller
Low power consumption
Wireless protocol support
High performance radio
-103 dBm sensitivity for Bluetooth® Low Energy 125-kbps LE Coded PHY
Output power up to +5 dBm with temperature compensation
Regulatory compliance
MCU peripherals
Security enablers
Development tools and software
Operating range
Package
The SimpleLink™CC2652RSIP is a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:
The CC2652RSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
PART NUMBER(1) | PACKAGE | BODY SIZE (NOM) |
---|---|---|
CC2652RSIPMOTR | QFM (73) | 7.00 mm × 7.00 mm |
Figure 4-1 shows the functional block diagram of the CC2652RSIP module.
Figure 4-2 shows an overview of the CC2652RSIP hardware.
Changes from Revision A (February 2022) to Revision B (September 2022)
Device | RADIO SUPPORT | FLASH (KB) | RAM + Cache (KB) | GPIO | PACKAGE SIZE | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sub-1 GHz Prop. | 2.4 GHz Prop. | Wireless M-Bus | Wi-SUN® | Sidewalk | Bluetooth® LE | ZigBee | Thread | Multiprotocol | +20 dBm PA | 4 x 4 mm VQFN (32) | 5 x 5 mm VQFN (32) | 5 x 5 mm VQFN (40) | 7 x 7 mm VQFN (48) | ||||
CC1310 | X | X | 32-128 | 16-20 + 8 | 10-30 | X | X | X | |||||||||
CC1311R3 | X | X | 352 | 32 + 8 | 22-30 | X | X | ||||||||||
CC1311P3 | X | X | X | 352 | 32 + 8 | 26 | X | ||||||||||
CC1312R | X | X | X | 352 | 80 + 8 | 30 | X | ||||||||||
CC1312R7 | X | X | X | X | X | 704 | 144 + 8 | 30 | X | ||||||||
CC1352R | X | X | X | X | X | X | X | X | 352 | 80 + 8 | 28 | X | |||||
CC1352P | X | X | X | X | X | X | X | X | X | 352 | 80 + 8 | 26 | X | ||||
CC1352P7 | X | X | X | X | X | X | X | X | X | X | 704 | 144 + 8 | 26 | X | |||
CC2640R2F | X | 128 | 20 + 8 | 10-31 | X | X | X | ||||||||||
CC2642R | X | 352 | 80 + 8 | 31 | X | ||||||||||||
CC2642R-Q1 | X | 352 | 80 + 8 | 31 | X | ||||||||||||
CC2651R3 | X | X | X | 352 | 32 + 8 | 23-31 | X | X | |||||||||
CC2651P3 | X | X | X | X | 352 | 32 + 8 | 22-26 | X | X | ||||||||
CC2652R | X | X | X | X | X | 352 | 80 + 8 | 31 | X | ||||||||
CC2652RB | X | X | X | X | X | 352 | 80 + 8 | 31 | X | ||||||||
CC2652R7 | X | X | X | X | X | 704 | 144 + 8 | 31 | X | ||||||||
CC2652P | X | X | X | X | X | X | 352 | 80 + 8 | 26 | X | |||||||
CC2652P7 | X | X | X | X | X | X | 704 | 144 + 8 | 26 | X |
Module | ANTENNA | RADIO SUPPORT | CERTIFICATIONS | FLASH (KB) | RAM + Cache (KB) | GPIO | PACKAGE SIZE | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
External | Integrated | Bluetooth® LE | ZigBee | +10 dBm PA | FCC/IC | CE | RER (UK) | Japan | 7 x 7 QFM (73) | 7 x 7 QFM (59) | 16.9 x 11.0 QFM (29) | ||||
CC2650MODA | X | X | X | X | X | X | 128 | 20+8 | 15 | X | |||||
CC2651R3SIPA | X | X | X | X | X | X | X | 352 | 32 + 8 | 32 | X | ||||
CC2652RSIP | X | X | X | X | X | X | 352 | 80 + 8 | 32 | X | |||||
CC2652PSIP | X | X | X | X | X | X | X | 352 | 80 + 8 | 30 | X |
The following I/O pins marked in Figure 7-1 in bold have high-drive capabilities:
The following I/O pins marked in Figure 7-1 in italics have analog capabilities:
PIN | I/O | TYPE | DESCRIPTION | |
---|---|---|---|---|
NAME | NO. | |||
DIO_0 | 14 | I/O | Digital | GPIO |
DIO_1 | 21 | I/O | Digital | GPIO |
DIO_10 | 28 | I/O | Digital | GPIO |
DIO_11 | 29 | I/O | Digital | GPIO |
DIO_12 | 30 | I/O | Digital | GPIO |
DIO_13 | 31 | I/O | Digital | GPIO |
DIO_14 | 32 | I/O | Digital | GPIO |
DIO_15 | 33 | I/O | Digital | GPIO |
DIO_16 | 36 | I/O | Digital | GPIO, JTAG_TDO, high-drive capability |
DIO_17 | 37 | I/O | Digital | GPIO, JTAG_TDI, high-drive capability |
DIO_18 | 39 | I/O | Digital | GPIO |
DIO_19 | 40 | I/O | Digital | GPIO |
DIO_2 | 20 | I/O | Digital | GPIO |
DIO_20 | 41 | I/O | Digital | GPIO |
DIO_21 | 42 | I/O | Digital | GPIO |
DIO_22 | 43 | I/O | Digital | GPIO |
DIO_23 | 44 | I/O | Digital or Analog | GPIO, analog capability |
DIO_24 | 45 | I/O | Digital or Analog | GPIO, analog capability |
DIO_25 | 48 | I/O | Digital or Analog | GPIO, analog capability |
DIO_26 | 1 | I/O | Digital or Analog | GPIO, analog capability |
DIO_27 | 2 | I/O | Digital or Analog | GPIO, analog capability |
DIO_28 | 3 | I/O | Digital or Analog | GPIO, analog capability |
DIO_29 | 7 | I/O | Digital or Analog | GPIO, analog capability |
DIO_3 | 15 | I/O | Digital | GPIO |
DIO_30 | 8 | I/O | Digital or Analog | GPIO, analog capability |
DIO_31(1) | 38 | I/O | Digital | Supports only peripheral functionality. Does not support general purpose I/O functionality. |
DIO_4 | 22 | I/O | Digital | GPIO |
DIO_5 | 23 | I/O | Digital | GPIO, high-drive capability |
DIO_6 | 24 | I/O | Digital | GPIO, high-drive capability |
DIO_7 | 25 | I/O | Digital | GPIO, high-drive capability |
DIO_8 | 26 | I/O | Digital | GPIO |
DIO_9 | 27 | I/O | Digital | GPIO |
GND | 5 | — | — | GND |
GND | 9 | — | — | GND |
GND | 10 | — | — | GND |
GND | 11 | — | — | GND |
GND | 12 | — | — | GND |
GND | 13 | — | — | GND |
GND | 16 | — | — | GND |
GND | 17 | — | — | GND |
GND | 19 | — | — | GND |
GND | 49-73 | — | — | GND |
NC | 6 | — | — | No Connect |
nRESET | 4 | I | Digital | Reset, active low. Internal pullup resistor to VDDS_PU |
RF | 18 | — | RF | 50 ohm RF port |
JTAG_TCKC | 35 | I | Digital | JTAG_TCKC |
JTAG_TMSC | 34 | I/O | Digital | JTAG_TMSC, high-drive capability |
VDDS | 46 | — | Power | 1.8-V to 3.8-V main SIP supply |
VDDS_PU | 47 | — | Power | Power to reset internal pullup resistor |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VDDS(3) | Supply voltage | –0.3 | 4.1 | V | |
Voltage on any digital pin(4)(5) | –0.3 | VDDS + 0.3, max 4.1 | V | ||
Vin | Voltage on ADC input | Voltage scaling enabled | –0.3 | VDDS | V |
Voltage scaling disabled, internal reference | –0.3 | 1.49 | |||
Voltage scaling disabled, VDDS as reference | –0.3 | VDDS / 2.9 | |||
Input level, RF pin | 5 | dBm | |||
Tstg | Storage temperature | –40 | 150 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
VESD | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | All pins | ±2000 | V |
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) | All pins | ±500 | V |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Operating junction temperature(1) | –40 | 105 | °C | |
Operating supply voltage (VDDS) | 1.8 | 3.8 | V | |
Rising supply voltage slew rate | 0 | 100 | mV/µs | |
Falling supply voltage slew rate | 0 | 20 | mV/µs |
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
VDDS Power-on-Reset (POR) threshold | 1.1 | 1.5 | V | ||
VDDS Brown-out Detector (BOD) | Rising threshold | 1.77 | V | ||
VDDS Brown-out Detector (BOD), before initial boot (1) | Rising threshold | 1.70 | V | ||
VDDS Brown-out Detector (BOD) | Falling threshold | 1.75 | V |
PARAMETER | TEST CONDITIONS | TYP | UNIT | |
---|---|---|---|---|
Core Current Consumption | ||||
Icore | Reset and Shutdown | Reset. nRESET pin asserted or VDDS below power-on-reset threshold(1) | 30 | µA |
Shutdown. No clocks running, no retention | 160 | nA | ||
Standby without cache retention |
RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF |
0.99 | µA | |
RTC running, CPU, 80KB RAM and (partial) register retention XOSC_LF |
1.15 | µA | ||
Standby with cache retention |
RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF |
3.36 | µA | |
RTC running, CPU, 80KB RAM and (partial) register retention. XOSC_LF |
3.47 | µA | ||
Idle | Supply Systems and RAM powered RCOSC_HF |
708 | µA | |
Active | MCU running CoreMark at 48 MHz RCOSC_HF |
3.5 | mA | |
Peripheral Current Consumption | ||||
Iperi | Peripheral power domain | Delta current with domain enabled | 102 | µA |
Serial power domain | Delta current with domain enabled | 7.56 | ||
RF Core | Delta current with power domain enabled, clock enabled, RF core idle |
221 | ||
µDMA | Delta current with clock enabled, module is idle | 67.1 | ||
Timers | Delta current with clock enabled, module is idle(4) | 85.1 | ||
I2C | Delta current with clock enabled, module is idle | 10.6 | ||
I2S | Delta current with clock enabled, module is idle | 27.6 | ||
SSI | Delta current with clock enabled, module is idle | 90.2 | ||
UART | Delta current with clock enabled, module is idle(2) | 175.9 | ||
CRYPTO (AES) | Delta current with clock enabled, module is idle(3) |
26.9 | ||
PKA | Delta current with clock enabled, module is idle |
88.9 | ||
TRNG | Delta current with clock enabled, module is idle |
37.4 | ||
Sensor Controller Engine Consumption | ||||
ISCE | Active mode | 24 MHz, infinite loop | 808 | µA |
Low-power mode | 2 MHz, infinite loop | 30.1 |