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  • CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

    • SWRS269B June   2023  – February 2025 CC2674P10

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  • CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier
  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  3VModules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy—Receive (RX)
    11. 7.11 Bluetooth Low Energy—Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4–2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Clock Input (TCXO)
        2. 7.14.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.14.3.3 48MHzRC Oscillator (RCOSC_HF)
        4. 7.14.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.14.3.6 32kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
  14. IMPORTANT NOTICE
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Data Sheet

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features

Wireless microcontroller

  • Powerful 48MHz Arm®Cortex®-M33 processor with TrustZone®
  • FPU and DSP extension
  • 1024kB flash program memory
  • 8kB of cache SRAM
  • 256kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32kB of additional SRAM if parity is disabled
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.3 Low Energy, IEEE 802.15.4 PHY, and MAC
  • Supports over-the-air update (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 4.0mA active mode, CoreMark®
    • 83μA/MHz running CoreMark
    • 1.19μA standby mode, RTC, 256kB SRAM
    • 0.13μA shutdown mode, wake-up on pin
  • Ultra-low-power sensor controller consumption
    • 32μA in 2MHz mode
    • 849μA in 24MHz mode
  • Radio consumption:
    • 6.4mA RX at 2.4GHz
    • 25mA TX at +10dBm at 2.4GHz
    • 102mA TX at +20dBm at 2.4GHz
    • 6.9mA TX at 0dBm at 2.4GHz

Wireless protocol support

  • Thread, Zigbee®, Matter
  • Bluetooth® 5.3 Low Energy
  • 6LoWPAN
  • Proprietary Systems

High-performance radio

  • -105dBm for Bluetooth® Low Energy 125kbps
  • -105dBm for IEEE 802.15.4-2006 2.4GHz OQPSK (coherent modem)
  • Output power up to +20dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for a trusted execution environment
  • AES 128-bit and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

  • LP-EM-CC1354P10-6 for dual-band and +10dBm output power on 2.4GHz
  • LP-XDS110, LP-XDS110ET or TMDSEMU110-U (with TMDSEMU110-ETH add-on) Debug Probe
  • SimpleLink™ LOWPOWER F2 Software Development Kit (SDK)
  • SmartRF™ Studio for simple radio configuration
  • Sensor Controller Studio for building low-power sensing applications
  • SysConfig system configuration tool

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40°C to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (26 GPIOs)
  • 8mm × 8mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

 
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