Arm®Cortex®-M33 processor (96MHz) with FPU
(floating point unit), TrustZone®-M support and CDE (custom datapath
extension) for machine learning acceleration
Algorithm Processing Unit (APU) (96MHz)
Mathematical accelerator for efficient vector and matrix operations
Bluetooth® 6.0 Channel Sounding post-processing support for IFFT
and advanced super-resolution algorithms like MUSIC (MUltiple SIgnal
Classification)
Wireless MCU Memory
Up to 1MB of in-system programmable flash
Up to 162KB of SRAM
32KB of System ROM with secure boot root
of trust (RoT) and a serial (SPI/UART) bootloader
Serial wire debug (SWD)
Qualified for automotive application
AEC-Q100 Grade 2 qualified:
Device temperature: –40°C to +125°C
junction temperature
HBM ESD Classification Level 2
CDM ESD Classification Level C3
MCU Peripherals
23 GPIOs, digital peripherals can be
routed to multiple GPIOs
Two IO pads SWD, multiplexed with
GPIOs
Two IO pads LFXT, multiplexed with
GPIOs
19 DIOs (analog or digital IOs)
All GPIOs with wakeup and interrupt
capabilities
3 × 16-bit and 1 × 32-bit general-purpose
timers, quadrature decode mode support
Real-time clock (RTC)
Watchdog timer
System timer for radio, RTOS, and
application operations for Bluetooth channel sounding postprocessing
12-bit ADC, up to 1.2Msps, 8 external
inputs
Temperature sensor and battery
monitor
1× low power comparator
2× UART with LIN capability
2× SPI
1× I2C
1× I2S
1× CAN-FD
controller
Security enablers
ISO21434
Automotive Cybersecurity Compliant
Hardware Security Module (HSM) with
proprietary controller and dedicated memories supporting accelerated cryptographic
operations and secure key storage:
AES (up to 256 bits) crypto
accelerator
ECC (up to 521 bits), RSA (up to 3072
bits) public key accelerator
SHA-2 (up to 512 bits)
accelerator
True random number generator
HSM firmware update support
Separate AES 128bit crypto accelerator
(LAES) for latency-critical link-layer crypto operations
Secure boot and secure firmware
updates
Cortex®-M33 TrustZone-M, MPU, memory
firewalls for software isolation
Voltage glitch monitor (VGM)
Low power consumption (at 3.3V)
On-chip buck DC/DC converter
RX current: 6.1mA
TX current at 0dBm: 7.7mA
TX current at +10dBm: 24mA
TX current at +20dBm: 128mA (P
version)
Active mode MCU 96MHz (CoreMark®): 6.8mA
Standby: 0.9µA (low power mode, RTC on,
full RAM retention)
Reset or Shutdown: 160nA
Wireless protocol supportHigh-performance radio
2.4GHz RF transceiver compatible with Bluetooth® Low Energy specification
Output power up to +10dBm (R
version)
Output power up to +20dBm (P
version)
Integrated BALUN
Integrated RF switch
Receiver sensitivity:
-103.5dBm for Bluetooth® LE 125kbps
-97dBm for Bluetooth® LE 1Mbps
Regulatory compliance
Designed for systems targeting compliance
with worldwide radio frequency regulations
EN 300 328 (Europe)
FCC CFR47 Part 15 (US)
ARIB STD-T66 (Japan)
Development Tools and Software
LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
BP-EM-CS Multiple antenna board for
Bluetooth 6.0 Channel Sounding
SimpleLink™ Low Power F3 Software
Development Kit (SDK)
Fully qualified Bluetooth® software
protocol stack in SDK
Up to 32 concurrent multirole connections
Bluetooth 6.0 Channel Sounding Support
CCC
Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems