SWRS304 October   2024 CC2745P10-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagram
  6. 5Device Comparison
  7. 6Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions – RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
      1. 7.2.1 SimpleLink™ Microcontroller Platform
    3. 7.3 Documentation Support
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Description

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth® Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for Bluetooth® 6.0 and earlier version features:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement Sets, CSA#2, as well as backward compatibility with earlier Low Energy specifications.
    • Bluetooth® Channel Sounding technology and Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation.
      • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms including FFT and super-resolution complex algorithms like MUSIC (MUltiple SIgnal Classification) at the lowest energy consumption.
  • Arm (Custom Data Extension) CDE instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • Isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by immutable system ROM
    • ARM Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection.
    • Dedicated AES-128 HW accelerator for handling timing critical link layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin even for the P version; thereby, enabling reduced a bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

Table 3-1 Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
CC2745P10-Q1 QFN40 6.0mm × 6.0mm
CC2745R10-Q1 QFN40 6.0mm × 6.0mm
CC2745R7-Q1 QFN40 6.0mm × 6.0mm
CC2744R7-Q1 QFN40 6.0mm × 6.0mm
For more information, see the Mechanical, Packaging, and Orderable addendum.
The package size (length × width) is a nominal value and includes pins, where applicable.