SWRS304A October   2024  – December 2024 CC2745P10-Q1 , CC2745R10-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions—RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy—Receive (RX)
    15. 7.15 Bluetooth Low Energy—Transmit (TX)
    16. 7.16 Bluetooth Channel Sounding
    17. 7.17 2.4GHz RX/TX CW
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.18.3.2 96 MHz RC Oscillator (HFOSC)
        3. 7.18.3.3 80/90/98 MHz RC Oscillator (AFOSC)
        4. 7.18.3.4 32 kHz Crystal Oscillator (LFXT)
        5. 7.18.3.5 32 kHz RC Oscillator (LFOSC)
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 UART
        1. 7.19.1.1 UART Characteristics
      2. 7.19.2 SPI
        1. 7.19.2.1 SPI Characteristics
        2. 7.19.2.2 SPI Controller Mode
        3. 7.19.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.19.2.4 SPI Peripheral Mode
        5. 7.19.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.19.3 I2C
        1. 7.19.3.1 I2C Characteristics
        2. 7.19.3.2 I2C Timing Diagram
      4. 7.19.4 I2S
        1. 7.19.4.1 I2S Controller Mode
        2. 7.19.4.2 I2S Peripheral Mode
      5. 7.19.5 CAN-FD
        1. 7.19.5.1 CAN-FD Characteristics
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
      7. 7.19.7 ADC
        1. 7.19.7.1 Analog-to-Digital Converter (ADC) Characteristics
      8. 7.19.8 Comparators
        1. 7.19.8.1 Low Power Comparator
      9. 7.19.9 Voltage Glitch Monitor
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.9 Power Consumption—Power Modes

Measured on the LP-EM-CC2745R10-Q1 reference design Tc = 25°C, VDDS = 3.0V, DC/DC enabled (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption with DCDC
Icore Active MCU running CoreMark from Flash at 96MHz  7.2 mA
Icore Active MCU running CoreMark from Flash at 96MHz, VDDS = 3.3V  6.8 mA
Icore Idle Supply Systems and SRAM powered, flash disabled, DMA disabled 1.5 mA
Icore Idle Supply Systems and SRAM powered, flash disabled, DMA disabled, VDDS = 3.3V 1.45 mA
Icore Idle Supply Systems and SRAM powered, flash disabled, DMA enabled 1.7 mA
Icore Idle Supply Systems and SRAM powered, flash disabled, DMA enabled, VDDS = 3.3V 1.6 mA
Icore Idle Supply Systems and SRAM powered, flash enabled, DMA disabled 1.9 mA
Icore Idle Supply Systems and SRAM powered, flash enabled, DMA disabled, VDDS = 3.3V 1.8 mA
Icore Idle Supply Systems and SRAM powered, flash enabled, DMA enabled 2.2 mA
Icore Idle Supply Systems and SRAM powered, flash enabled, DMA enabled, VDDS = 3.3V 2.1 mA
Icore Standby RTC running, full SRAM retention 
LFOSC, DCDC recharge current setting (ipeak (1) = 0) 		 0.95 µA
Icore Standby RTC running, full SRAM retention 
LFOSC, DCDC recharge current setting (ipeak (1) = 0), VDDS = 3.3V 		 0.9 µA
Icore Standby RTC running, full SRAM retention 
LFXT DCDC recharge current setting (ipeak (1) = 0) 		 1.0 µA
Icore Standby RTC running, full SRAM retention 
LFXT DCDC recharge current setting (ipeak (1) = 0), VDDS = 3.3V 		 0.9 µA
Core Current consumption with GLDO
Icore Active MCU running CoreMark from Flash at 96MHz, DC/DC disabled 11.2 mA
Icore Idle Supply Systems and RAM powered, flash disabled, DMA disabled,  DC/DC disabled 2.45
mA
 
Icore Idle Supply Systems and RAM powered, flash disabled, DMA enabled, DC/DC disabled 2.75
mA
 
Icore Idle Supply Systems and RAM powered, flash enabled, DMA disabled, DC/DC disabled 2.8
mA
 
Icore Idle Supply Systems and RAM powered, flash enabled, DMA enabled, DC/DC disabled 3.4
mA
 
Icore Standby RTC running, full SRAM retention, DC/DC disabled
LFOSC, default GLDO recharge current setting  		1.5 µA
Icore Standby RTC running, full SRAM retention, DC/DC disabled
LFXT, default GLDO recharge current setting  		 1.6 µA
Reset, Shutdown Current Consumption
Icore Reset Reset. RSTN pin asserted or VDDS below power-on-reset threshold  170 nA
Icore Shutdown Shutdown measured in steady state. No clocks running, no retention, IO wakeup enabled 160 nA
Peripheral Current Consumption
Iperi RF Delta current with clock enabled, RF subsystem idle 80 µA
Iperi Timers Delta current with clock enabled, module is idle (4) 6.5 µA
Iperi I2C Delta current with clock enabled, module is idle  11 µA
Iperi SPI Delta current with clock enabled, module is idle (3) 5 µA
Iperi UART Delta current with clock enabled, module is idle(2) 43 µA
Iperi I2S Delta current with clock enabled, module is idle 190 µA
Iperi CRYPTO (LAES) Delta current with clock enabled, module is idle 10 µA
Iperi APU  Delta current with clock enabled, module is idle 186 µA
(1) Ipeak refers to the programmable DCDC peak current setting used to vary the maximum DCDC load support.
(2) Only one UART peripheral instance enabled 
(3) Only one SPI peripheral instance enabled 
(4) Only one LGPT timer instance enabled