SWRS342
September 2024
CC3301MOD
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Functional Block Diagrams
5
Device and Documentation Support
5.1
Third-Party Products Disclaimer
5.2
Device Nomenclature Boilerplate
5.3
Tools and Software
5.4
Documentation Support
5.5
Support Resources
5.6
Trademarks
5.7
Electrostatic Discharge Caution
5.8
Glossary
6
Revision History
7
Mechanical, Packaging, and Orderable Information
1
Features
Key Features
Wi-Fi 6 (802.11ax)
Bluetooth®
Low Energy 5.4 in CC33x1MOD
Companion module to any processor or MCU host capable of running a TCP/IP stack
Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power
Operating temperature: –40°C to +85°C
Application throughput up to 50Mbps
Regulatory Certification (in progress)
FCC
IC/ISED
ETSI/CE
TELEC
QuickTrack Qualified
Bluetooth Controller Subsystem Qualified
Extended Features
Wi-Fi 6
2.4GHz, 20MHz, single spatial stream
MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
Target wake time (TWT), OFDMA, MU-MIMO (downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
Hardware-based encryption and decryption supporting WPA2 and WPA3
Excellent interoperability
Support for 4-bit SDIO or SPI host interfaces
Bluetooth Low Energy 5.4
LE Coded PHYs (long range), LE 2M PHY (high speed) and Advertising Extension
Host controller interface (HCI) transport with option for UART or shared SDIO
Internal coexistence mechanism with Wi-Fi to share same antenna
Enhanced Security
Secured host interface
Firmware authentication
Anti-rollback protection
Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
Optional antenna diversity or selection
3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (for example, Thread or Zigbee)
Clock sources
40MHz XTAL fast clock (Integrated in the module)
Internal slow clock or external 32.768kHz slow clock
Small package size
Easy to design with 65-pin, 11mm × 11mm LGA package, 0.65mm pitch