SWRU546E October   2018  – May 2022 AWR6843 , AWR6843AOP , IWR6443 , IWR6843 , IWR6843AOP

 

  1.   Trademarks
  2. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
      1. 1.2.1 Summary of Features
      2. 1.2.2 xWR6843ISK
      3. 1.2.3 IWR6843ISK-ODS (Overhead Detection Sensing)
      4. 1.2.4 IWR6843AOP
      5. 1.2.5 MMWAVEICBOOST
    3. 1.3 What’s Included
      1. 1.3.1 Kit Contents
        1. 1.3.1.1 xWR6843ISK
        2. 1.3.1.2 IWR6843ISK-ODS
        3. 1.3.1.3 IWR6843AOPEVM
        4. 1.3.1.4 MMWAVEICBOOST
  3. 2MMWAVEICBOOST
    1. 2.1 Hardware
    2. 2.2 Block Diagram and Features
      1. 2.2.1 Block Diagram
      2. 2.2.2 Hardware Features
    3. 2.3 Muxing Scheme for Multiple Sources
    4. 2.4 Using the MMWAVEICBOOST With the Starter Kit
      1. 2.4.1 PC Connection
      2. 2.4.2 Flashing the QSPI Flash on the Antenna Module
      3. 2.4.3 MMWAVEICBOOST and Antenna Module Connections for Modular Testing
    5. 2.5 Interfacing with the DCA1000EVM
      1. 2.5.1 mmWave Studio Interface
      2. 2.5.2 MMWAVEICBOOST and Antenna Module Configuration
      3. 2.5.3 DCA1000 EVM Connection
    6. 2.6 Power Connections
    7. 2.7 Connectors
      1. 2.7.1 20-Pin LaunchPad and Booster Pack Connectors (J5, J6)
      2. 2.7.2 60-Pin High Density (HD) Connector (J4 and J17)
      3. 2.7.3 60-Pin High Density (HD) Connector (J10)
      4. 2.7.4 MIPI 60-Pin Connector (J9)
      5. 2.7.5 TI 14-Pin JTAG Connector (J19)
      6. 2.7.6 CAN Connector (J1 and J2)
      7. 2.7.7 Ultra-Miniature Coaxial Connector (J3)
    8. 2.8 Jumpers, Switches and LEDs
      1. 2.8.1 Sense on Power (SOP) Jumpers
      2. 2.8.2 I2C Connections
        1. 2.8.2.1 Default I2C Address
        2. 2.8.2.2 43
        3. 2.8.2.3 3.3-V Rail Options
        4. 2.8.2.4 Miscellaneous Headers
        5. 2.8.2.5 Switches and LEDs
          1. 2.8.2.5.1 Switches
  4. 3xWR6843ISK / IWR6843ISK-ODS REV C
    1. 3.1  Hardware
      1. 3.1.1 xWR6843ISK EVM
      2. 3.1.2 IWR6843ISK-ODS EVM
    2. 3.2  xWR6843ISK/IWR6843ISK-ODS Block Diagram
    3. 3.3  PCB Storage and Handling Recommendations
    4. 3.4  Power Connections
      1. 3.4.1 Higher Power Applications
    5. 3.5  Interfaces
      1. 3.5.1 Switches, Buttons and Muxes
      2. 3.5.2 List of LEDs
      3. 3.5.3 CANFD
      4. 3.5.4 I2C Connections
        1. 3.5.4.1 EEPROM
        2. 3.5.4.2 Default I2C Address
    6. 3.6  xWR6843ISK Antenna
    7. 3.7  IWR6843ISK-ODS Antenna
    8. 3.8  Modular Mode
    9. 3.9  DCA1000EVM Mode
    10. 3.10 MMWAVEICBOOST Mode
  5. 4xWR6843AOPEVM Rev G
    1. 4.1  Hardware
    2. 4.2  Block Diagram
    3. 4.3  PCB Storage and Handling Recommendations
    4. 4.4  Heat Sink and Temperature
    5. 4.5  xWR6843AOPEVM Antenna
    6. 4.6  Switch Settings
    7. 4.7  xWR6843AOPEVM Muxing Scheme
      1. 4.7.1 SOP Configuration
    8. 4.8  Modular, DCA1000EVM and MMWAVEICBOOST Mode
      1. 4.8.1 Modular Mode
      2. 4.8.2 DCA1000EVM Mode
      3. 4.8.3 MMWAVEICBOOST Mode
    9. 4.9  Known Issues: Spurious Performance
    10. 4.10 PC Connection
      1. 4.10.1 Installing the Drivers
      2. 4.10.2 Flashing the Board
    11. 4.11 REACH Compliance
    12. 4.12 Regulatory Statements with Respect to the xWR6843AOPEVM Rev G
  6. 5xWR6843AOPEVM Rev F
    1. 5.1  Hardware
    2. 5.2  Block Diagram
    3. 5.3  PCB Storage and Handling Recommendations
    4. 5.4  Heat Sink and Temperature
    5. 5.5  xWR6843AOPEVM Antenna
    6. 5.6  Switch Settings
    7. 5.7  xWR6843AOPEVM Muxing Scheme
      1. 5.7.1 SOP Configuration
    8. 5.8  Modular and MMWAVEICBOOST Mode
      1. 5.8.1 Modular Mode
      2. 5.8.2 MMWAVEICBOOST Mode
    9. 5.9  PC Connection
      1. 5.9.1 Installing the Drivers
      2. 5.9.2 Flashing the Board
      3. 5.9.3 DCA1000
    10. 5.10 REACH Compliance
  7. 6IWR6843ISK / IWR6843ISK-ODS (deprecated)
    1. 6.1 Hardware
      1. 6.1.1 IWR6843ISK EVM
      2. 6.1.2 IWR6843ISK-ODS EVM
    2. 6.2 IWR6843ISK/IWR6843ISK-ODS Block Diagram
    3. 6.3 PCB Storage and Handling Recommendations
    4. 6.4 Power Connections
    5. 6.5 Miscellaneous and LEDs
      1. 6.5.1 List of LEDs
      2. 6.5.2 I2C Connections
        1. 6.5.2.1 EEPROM
        2. 6.5.2.2 Default I2C Address
    6. 6.6 IWR6843ISK Antenna
    7. 6.7 IWR6843ISK-ODS Antenna
  8. 7IWR6843AOPEVM (Deprecated)
    1. 7.1 Hardware
    2. 7.2 Block Diagram
    3. 7.3 PCB Storage and Handling Recommendations
    4. 7.4 IWR6843AOPEVM Antenna
    5. 7.5 Switch Settings
    6. 7.6 IWR6843AOPEVM Muxing Scheme
      1. 7.6.1 SOP Configuration
    7. 7.7 Modular and MMWAVEICBOOST Mode
      1. 7.7.1 Modular Mode
      2. 7.7.2 MMWAVEICBOOST Mode
    8. 7.8 PC Connection
      1. 7.8.1 Installing the Drivers
      2. 7.8.2 Flashing the Board
      3. 7.8.3 DCA1000
    9. 7.9 REACH Compliance
  9. 8TI E2E Community
  10. 9Certification Related Information
  11.   Revision History

2.4.3 MMWAVEICBOOST and Antenna Module Connections for Modular Testing

A compatible antenna module can be stacked on top of the MMWAVEICBOOST board using the two 60-pin HD connectors and 12 nuts, four washers, and four M3 screws (for improving the thermal performance). Connectors have a pin number marking shown in Figure 2-18 to prevent the misalignment of the pins or reverse connection. Figure 2-10 shows the integration of MMWAVEICBOOST and starter kit. The starter kit is powered by the 3.3-V supply. There is one micro USB cable to XDS110 (J11) to run the out-of-box demo, and one micro USB cable to FTDI (J12) for initiating controls from mmWave Studio. Digital controls from the MMWAVEICBOOST are initiated after the FTDI and XDS110 ports are detected in the device manager shown in Figure 2-9. The configuration of the MMWAVEICBOOST and starter kit are based on the analog mux settings and mux controls received from the dip switch (S1). To mux all the digital controls to the FTDI/XDS110 connector, set the mux control switch positions to ON/OFF, as shown in Table 2-1.

GUID-EB6D78CA-F866-4DA7-BDB2-2FF7461A1505-low.pngFigure 2-10 Integration of MMWAVEICBOOST and Starter Kit

Figure 2-11 shows the mechanical mounting of PCB. Spacers and screws can be used as heat sinking elements to spread the heat from the starter kit to carrier board, as shown in Figure 2-11.

GUID-0864894A-A81A-4BD7-9A45-44FA789476DB-low.jpg Figure 2-11 Mechanical Mounting of the PCB