SWRU548C February   2019  – September 2021 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

 

  1. 1Introduction
    1. 1.1 CC3235MODSF LaunchPad™
    2. 1.2 LAUNCHCC3235MOD Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 REACH Compliance
    5. 1.5 Regulatory Compliance
    6. 1.6 First Steps: Out-of-Box Experience
      1. 1.6.1 Connecting to the Computer
      2. 1.6.2 Running the Out-of-Box Experience
    7. 1.7 Next Steps: Looking into the Provided Code
    8. 1.8 Trademarks
  2. 2Hardware
    1. 2.1 Block Diagram
    2. 2.2 Hardware Features
      1. 2.2.1  Key Benefits
      2. 2.2.2  XDS110-Based Onboard Debug Probe
      3. 2.2.3  Debug Probe Connection: Isolation Jumper Block
      4. 2.2.4  Application (or "Backchannel") UART
      5. 2.2.5  JTAG Headers
      6. 2.2.6  Using the XDS110 Debug Probe with a Different Target
      7. 2.2.7  Power Connections
        1. 2.2.7.1 XDS110 USB Power
        2. 2.2.7.2 BoosterPack Plug-in Module and External Power Supply
      8. 2.2.8  Reset Pullup Jumper
      9. 2.2.9  Clocking
      10. 2.2.10 I2C Connection
        1. 2.2.10.1 Default I2C Addresses
      11. 2.2.11 Sense on Power (SOP)
      12. 2.2.12 Push-Buttons and LED Indicators
    3. 2.3 Electrical Characteristics
    4. 2.4 Antenna Characteristics
    5. 2.5 BoosterPack Plug-in Module Pinout
  3. 3Layout Guidelines
    1. 3.1 LAUNCHCC3235MOD Board Layout
    2. 3.2 General Layout Recommendations
    3. 3.3 RF Layout Recommendations
    4. 3.4 Antenna Placement and Routing
    5. 3.5 Transmission Line Considerations
  4. 4Operational Setup and Testing
    1. 4.1 Measuring the CC3235MOD Current Draw
      1. 4.1.1 Low-Current Measurement with USB Power (<1 mA)
      2. 4.1.2 Active Current Measurements
    2. 4.2 RF Connections
      1. 4.2.1 AP Connection Testing
    3. 4.3 Design Files
      1. 4.3.1 Hardware Design Files
    4. 4.4 Software
  5. 5Development Environment Requirements
    1. 5.1 CCS
    2. 5.2 IAR
  6. 6Additional Resources
    1. 6.1 CC3235MODx Product Page
    2. 6.2 Download CCS or IAR
    3. 6.3 SimpleLink™ Academy for CC3235 SDK
    4. 6.4 TI E2E Support Forums
  7. 7Assembly Drawing and Schematics
    1. 7.1 Assembly Drawing
    2. 7.2 Schematics
      1.      A Manual Information to the End User
        1.       A.1 End User Manual
        2.       A.2 RF Function and Frequency Range
        3.       A.3 FCC and IC Certification and Statement
          1.        A.3.1 FCC
          2.        A.3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement
          3.        A.3.3 End Product Labeling
          4.        A.3.4 Device Classifications
          5.        A.3.5 FCC Definitions
          6.        A.3.6 Simultaneous Transmission Evaluation
        4.       A.4 EU Certification and Statement
          1.        A.4.1 RF Exposure Information (MPE)
          2.        A.4.2 Simplified DoC Statement
            1.         A.4.2.1 CC3235MODx and CC3235MODAx Modules
            2.         A.4.2.2 LAUNCHCC3235MOD
          3.        A.4.3 Waste Electrical and Electronic Equipment (WEEE)
          4.        A.4.4 OEM and Host Manufacturer Responsibilities
          5.        A.4.5 Antenna Specifications
        5.       A.5 CC3235MODx Approved Antennas
          1.        B Revision History

3.5 Transmission Line Considerations

The RF signal from the module is routed to the antenna using a coplanar waveguide with ground (CPW-G) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding. Figure 3-7 shows a cross section of the coplanar waveguide with the critical dimensions.

GUID-D026ACAE-C872-4BF7-BC8C-2CC223D4F5DF-low.gifFigure 3-7 Coplanar Waveguide (Cross Section)

Figure 3-8 shows the top view of the coplanar waveguide with GND and via stitching.

GUID-6F9EEE09-9A88-40C7-B0AF-D735652AEF5B-low.gifFigure 3-8 CPW With GND and Via Stitching (Top View)

 

The recommended values for the PCB are provided for 2-layer boards in Table 3-2 and for 4-layer boards in Table 3-3.

Table 3-2 Recommended PCB Values for 2-Layer Board (L1 to L2 = 42.1 mils)
PARAMETERVALUEUNIT
W26mils
S5.5mils
H42.1mils
Er (FR-4 substrate)4.2F/m

 

Table 3-3 Recommended PCB Values for 4-Layer Board (L1 to L2 = 16 mils)
PARAMETERVALUEUNITS
W21mils
S10mils
H16mils
Er (FR-4 substrate)4.5F/m