SWRU548C February   2019  – September 2021 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

 

  1. 1Introduction
    1. 1.1 CC3235MODSF LaunchPad™
    2. 1.2 LAUNCHCC3235MOD Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 REACH Compliance
    5. 1.5 Regulatory Compliance
    6. 1.6 First Steps: Out-of-Box Experience
      1. 1.6.1 Connecting to the Computer
      2. 1.6.2 Running the Out-of-Box Experience
    7. 1.7 Next Steps: Looking into the Provided Code
    8. 1.8 Trademarks
  2. 2Hardware
    1. 2.1 Block Diagram
    2. 2.2 Hardware Features
      1. 2.2.1  Key Benefits
      2. 2.2.2  XDS110-Based Onboard Debug Probe
      3. 2.2.3  Debug Probe Connection: Isolation Jumper Block
      4. 2.2.4  Application (or "Backchannel") UART
      5. 2.2.5  JTAG Headers
      6. 2.2.6  Using the XDS110 Debug Probe with a Different Target
      7. 2.2.7  Power Connections
        1. 2.2.7.1 XDS110 USB Power
        2. 2.2.7.2 BoosterPack Plug-in Module and External Power Supply
      8. 2.2.8  Reset Pullup Jumper
      9. 2.2.9  Clocking
      10. 2.2.10 I2C Connection
        1. 2.2.10.1 Default I2C Addresses
      11. 2.2.11 Sense on Power (SOP)
      12. 2.2.12 Push-Buttons and LED Indicators
    3. 2.3 Electrical Characteristics
    4. 2.4 Antenna Characteristics
    5. 2.5 BoosterPack Plug-in Module Pinout
  3. 3Layout Guidelines
    1. 3.1 LAUNCHCC3235MOD Board Layout
    2. 3.2 General Layout Recommendations
    3. 3.3 RF Layout Recommendations
    4. 3.4 Antenna Placement and Routing
    5. 3.5 Transmission Line Considerations
  4. 4Operational Setup and Testing
    1. 4.1 Measuring the CC3235MOD Current Draw
      1. 4.1.1 Low-Current Measurement with USB Power (<1 mA)
      2. 4.1.2 Active Current Measurements
    2. 4.2 RF Connections
      1. 4.2.1 AP Connection Testing
    3. 4.3 Design Files
      1. 4.3.1 Hardware Design Files
    4. 4.4 Software
  5. 5Development Environment Requirements
    1. 5.1 CCS
    2. 5.2 IAR
  6. 6Additional Resources
    1. 6.1 CC3235MODx Product Page
    2. 6.2 Download CCS or IAR
    3. 6.3 SimpleLink™ Academy for CC3235 SDK
    4. 6.4 TI E2E Support Forums
  7. 7Assembly Drawing and Schematics
    1. 7.1 Assembly Drawing
    2. 7.2 Schematics
      1.      A Manual Information to the End User
        1.       A.1 End User Manual
        2.       A.2 RF Function and Frequency Range
        3.       A.3 FCC and IC Certification and Statement
          1.        A.3.1 FCC
          2.        A.3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement
          3.        A.3.3 End Product Labeling
          4.        A.3.4 Device Classifications
          5.        A.3.5 FCC Definitions
          6.        A.3.6 Simultaneous Transmission Evaluation
        4.       A.4 EU Certification and Statement
          1.        A.4.1 RF Exposure Information (MPE)
          2.        A.4.2 Simplified DoC Statement
            1.         A.4.2.1 CC3235MODx and CC3235MODAx Modules
            2.         A.4.2.2 LAUNCHCC3235MOD
          3.        A.4.3 Waste Electrical and Electronic Equipment (WEEE)
          4.        A.4.4 OEM and Host Manufacturer Responsibilities
          5.        A.4.5 Antenna Specifications
        5.       A.5 CC3235MODx Approved Antennas
          1.        B Revision History

2.2.1 Key Benefits

The CC3235MODx and CC3235MODAx modules offer the following benefits:

  • CC3235MODS and CC3235MODAS are Wi-Fi modules that consist of the CC3235SM2ARGK while the CC3235MODSF and the CC3220MODASF consist of the CC3235SF12ARGK single-chip MCUs, respectively. The fully integrated and green/RoHS modules includes all required clocks, spi flash, and passives
  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz
  • FCC, IC/ISED, ETSI/CE, MIC. and SRRC (2)Certified
  • FIPS 140-2 Level 1 validated IC inside
  • Multilayered security features, help developers protect identities, data, and software IP
  • Low-power modes for battery powered application
  • Coexistence with 2.4-GHz radios
  • Industrial temperature: –40°C to +85°C
  • CC3235MODx multiple-core architecture, system-on-chip (SoC)
  • 1.27-mm pitch QFM package for easy assembly and low-cost PCB design
  • Transferrable Wi-Fi Alliance® certification
  • Application microcontroller subsystem:
    • Arm® Cortex®-M4 core at 80 MHz
    • User-dedicated memory
      • CC3235MODS and CC3235MODAS variant includes 256KB RAM
      • CC3235MODSF and CC3235MODASF variant is flash-based MCU with an integrated 1MB executable flash and 256KB of RAM.
    • Rich set of peripherals and timers
    • 26 I/O pins with flexible multiplexing options
      • UART, I2S, I2C, SPI, SD, ADC, and 8-bit parallel interface
      • 8-bit synchronous image interface
      • Timers and PWM
    • Debug interfaces: JTAG, cJTAG, and SWD
  • Wi-Fi network processor subsystem:
    • Wi-Fi® core:
      • 802.11 a/b/g/n 2.4 GHz and 5 GHz
      • Modes:
        • Access point (AP)
        • Station (STA)
        • Wi-Fi Direct® (only supported on 2.4 GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always, intermittent, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Multilayered security features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • Application-level security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Application Throughput
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Power-management subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3 V to 3.6 V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5 µA
      • Low-power deep sleep (LPDS): 120 µA
      • Idle connected (MCU in LPDS): 710 µA
      • RX traffic (MCU active): 59 mA
      • TX traffic (MCU active): 223 mA
    • Wi-Fi TX power
      • 2.4 GHz: 16 dBm at 1 DSSS
      • 5 GHz: 15.1 dBm at 6 OFDM
    • Wi-Fi RX sensitivity
      • 2.4 GHz: –94.5 dBm at 1 DSSS
      • 5 GHz: –89 dBm at 6 OFDM
  • Additional integrated components
    • 40.0-MHz crystal
    • 32.768-kHz crystal (RTC)
    • 32Mbit SPI serial flash
    • RF filters, diplexer, and passive components
  • Footprint compatible QFM package
    • CC3235MODx: 1.27-mm pitch,
      63-pin, 20.5-mm × 17.5-mm
  • Module supports SimpleLink Developer's Ecosystem
2. Contact TI for more information on using SRRC ID Certification: www.ti.com/tool/SIMPLELINK-CC3XXX-CERTIFICATION