SWRU619A July   2024  – December 2024

 

  1.   1
  2.   Description
  3.   Applications
  4.   Get Started
  5.   Features
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1  xWRL1432BOOST-BSD Antenna
      1. 2.1.1 PCB Material
        1. 2.1.1.1 Transmitter and Receiver Virtual Array
    2. 2.2  EVM Mux Block Diagram
    3. 2.3  Switch Settings
    4. 2.4  LEDs
    5. 2.5  Connectors
    6. 2.6  USB Connector
    7. 2.7  DCA1000 HD Connector
    8. 2.8  Booster Pack Connector for the LaunchPad Connectivity
    9. 2.9  SPI-CAN Driver
    10. 2.10 CAN-FD Connector
    11. 2.11 LIN PHY Connection
    12. 2.12 I2C Connections
      1. 2.12.1 EEPROM
    13. 2.13 XDS110 Interface
    14. 2.14 Flashing the Board
    15. 2.15 DCA1000EVM Mode
      1. 2.15.1 RDIF Interface for Raw ADC Capture
    16. 2.16 PCB Storage and Handling Recommendations:
      1. 2.16.1 PCB Storage and Handling Recommendations
      2. 2.16.2 Higher Power Demanding Applications
  9. 3Software
    1. 3.1 Software, Development Tools, and Example Code
      1. 3.1.1 xWRL1432 Demo Visualization Getting Started
  10. 4Hardware Design Files
    1. 4.1 Schematics, PCB Layout and Bill of Materials (BOM)
    2. 4.2 EVM Design Database
  11. 5Additional Information
    1.     Trademarks
  12. 6References
    1. 6.1 TI E2E Community
  13.   Revision History

2.1.1 PCB Material

Dielectric material used for this PCB is Rogers RO3003 of 5mil thickness with rolled copper for the Antenna and transmission lines while 370HR is used for the rest of the layers.

xWRL1432BOOST-BSD