CC2651R3 SimpleLink™ Wireless MCU Device Revision B

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1 Advisories Matrix

Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.

Table 1-1 Advisories Matrix

MODULE	DESCRIPTION	SILICON REVISIONS AFFECTED
MODULE	DESCRIPTION	B
Radio	Advisory Radio_04— Reduced RX sensitivity when using integrated DC/DC converter	Yes
Power	Advisory Power_03 — Increased voltage ripple at low supply voltages when DC/DC converter is enabled	Yes
I2C	Advisory I2C_01 — I²C module master status bit is set late	Yes
I2S	Advisory I2S_01 — I²S bus faults are not reported	Yes
CPU	Advisory CPU_01 — Arm® Errata #838869: Store immediate overlapping exception return operation might vector to incorrect interrupt	Yes
CPU	Advisory CPU_02 — Arm® Errata #752770: Interrupted loads to SP can cause erroneous behavior	Yes
CPU, System	Advisory CPU_Sys_01 — The SysTick calibration value (register field CPU_SCS.STCR.TENMS) used to set up 10-ms periodic ticks is incorrect when the system CPU is running off divided down 48-MHz clock	Yes
System	Advisory Sys_01 — Device might boot into ROM serial bootloader when waking up from shutdown	Yes
System	Advisory Sys_05 — Elevated power-on-reset (POR) threshold voltage at low temperatures	Yes
System Controller	Advisory SYSCTRL_01 — Resets occurring in a specific 2-MHz period during initial power up are incorrectly reported	Yes
ADC	Advisory ADC_01 — Periodic ADC trigger at 200 kHz rate can be ignored when XOSC_HF is turned on or off	Yes
ADC	Advisory ADC_02 — ADC samples can be delayed by 2 or 14 clock cycles (24 MHz) when XOSC_HF is turned on or off, resulting in sample jitter	Yes
ADC	Advisory ADC_03 — Software can hang when reading the ADC FIFO if a single manual ADC trigger is generated immediately after the ADC is enabled	Yes

2 Nomenclature, Package Symbolization, and Revision Identification

2.1 Device and Development Support-Tool Nomenclature

To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC2651R3). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.

Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.

null

Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX

Development-support product that has not yet completed Texas Instruments internal qualification testing.

TMDS

Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.