This document describes the known exceptions to functional specifications (advisories) to the CC2651R3SIPASimpleLink™ device.
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Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.
MODULE | DESCRIPTION | SILICON REVISIONS AFFECTED | |||
---|---|---|---|---|---|
B | |||||
Radio | Radio_04 — Reduced RX sensitivity when using integrated DC/DC converter | Yes | |||
Power | Power_03 — Increased voltage ripple at low supply voltages when DC/DC converter is enabled | Yes | |||
I2C | I2C_01 — I2C module master status bit is set late | Yes | |||
I2S | I2S_01 — I2S bus faults are not reported | Yes | |||
CPU | CPU_01 — Arm® Errata #838869: Store immediate overlapping exception return operation might vector to incorrect interrupt | Yes | |||
CPU | CPU_02 — Arm® Errata #752770: Interrupted loads to SP can cause erroneous behavior | Yes | |||
CPU, System | CPU_Sys_01 — The SysTick calibration value (register field CPU_SCS.STCR.TENMS) used to set up 10-ms periodic ticks is incorrect when the system CPU is running off divided down 48-MHz clock | Yes | |||
System | Sys_01 — Device might boot into ROM serial bootloader when waking up from shutdown | Yes | |||
System | Sys_05 — Elevated power-on-reset (POR) threshold voltage at low temperatures | Yes | |||
System Controller | SYSCTRL_01 — Resets occurring in a specific 2-MHz period during initial power up are incorrectly reported | Yes | |||
ADC | ADC_01 — Periodic ADC trigger at 200 kHz rate can be ignored when XOSC_HF is turned on or off | Yes | |||
ADC | ADC_02 — ADC samples can be delayed by 2 or 14 clock cycles (24 MHz) when XOSC_HF is turned on or off, resulting in sample jitter | Yes | |||
ADC | ADC_03 — Software can hang when reading the ADC FIFO if a single manual ADC trigger is generated immediately after the ADC is enabled | Yes |
To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC2651R3SIPA). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).
Device development evolutionary flow:
Support tool development evolutionary flow:
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.