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Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.
MODULE | DESCRIPTION | SILICON REVISIONS AFFECTED | |||
---|---|---|---|---|---|
C | |||||
Radio | Advisory Radio_01 — Proprietary radio modes: spurious emissions can affect regulatory compliance | Yes | |||
Radio | Advisory Radio_02 — High-power PA operation at temperatures below -20°C may affect the 32 kHz crystal oscillator | Yes | |||
Radio | Advisory Radio_05 — Zigbee has a negative 3dB RSSI offset error with internal bias | Yes | |||
Power | Advisory Power_03 — Increased voltage ripple at low supply voltages when DC/DC converter is enabled | Yes | |||
PKA | Advisory PKA_01 — Public key accelerator (PKA) interrupt line is always high when module is enabled and PKA is idle | Yes | |||
PKA | Advisory PKA_02 — Public key accelerator (PKA) RAM is not byte accessible | Yes | |||
I2C | Advisory I2C_01 — I2C module master status bit is set late | Yes | |||
I2S | Advisory I2S_01 — I2S bus faults are not reported | Yes | |||
CPU, System | Advisory CPU_Sys_01 — The SysTick calibration value (register field CPU_SCS.STCR.TENMS) used to set up 10-ms periodic ticks is incorrect when the system CPU is running off divided down 48 MHz clock | Yes | |||
CPU | Advisory CPU_04 — The Instrumentation Trace Macrocell (ITM) and Data Watchpoint and Trace (DWT) are active only if an external debug probe is attached to the JTAG port of the device | Yes | |||
System | Advisory Sys_01 — Device might boot into ROM serial bootloader when waking up from shutdown | Yes | |||
System Controller | Advisory SYSCTRL_01 — Resets occurring in a specific 2 MHz period during initial power up are incorrectly reported | Yes | |||
IO Controller | Advisory IOC_01 — Limited number of DIOs available for the bootloader backdoor | Yes | |||
ADC | Advisory ADC_02 — ADC samples can be delayed by 2 or 14 clock cycles (24 MHz) when XOSC_HF is turned on or off, resulting in sample jitter | Yes | |||
Flash | Advisory Flash_02 — Flash bank erase may timeout when operating at low temperatures with a low VDDS supply voltage | Yes |
To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC1354P10). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).
Device development evolutionary flow:
Support tool development evolutionary flow:
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
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