TIDT279 October   2022

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Test Prerequisites
    1. 1.1 Power and Load Connections and Test Points
    2. 1.2 Voltage and Current Requirements
    3. 1.3 Required Equipment
    4. 1.4 Considerations
    5. 1.5 Board Dimensions
  5. 2Testing and Results
    1. 2.1 Efficiency and Loss Graphs
    2. 2.2 Thermal Images
    3. 2.3 Bode Plots
    4. 2.4 Conducted Emissions vs CISPR Class 5
  6. 3Waveforms
    1. 3.1 Output Voltage Ripple
    2. 3.2 Load Transients
    3. 3.3 Start-Up of Each Independently-Controlled Output

Thermal Images

Figure 2-7 through Figure 2-10 show the worst-case thermal images. All outputs are loaded to their maximum; or 6.7 A off the 3.3 V, 120 mA off the 5 V, and 600 mA off the 8 V. Thermal images were taken at 10 VIN, 14 VIN and 18 VIN. Ambient is room temperature or about 22°C, and there are no fans blowing on the boards.

GUID-20220913-SS0I-H1B8-L305-LVBZLV4FJ9MB-low.jpgFigure 2-7 Input Reverse Protection Diode D1 Worst Case at 10 VIN, 91°C
GUID-20220913-SS0I-33QG-VBJW-NPBSQSRGZ5Z6-low.jpgFigure 2-9 Output Rectifier of the 8-V SEPIC D2 Worst Case at 10 VIN, 72°C
GUID-20220913-SS0I-3VPN-BMM4-QVM7VMCNBV20-low.jpgFigure 2-8 High-Side FET Q4 of the 3.3-V Buck Converter Worst Case at 18 VIN, 71°C
GUID-20220913-SS0I-PS3M-RDCP-FLX9Q9TMLKFW-low.jpgFigure 2-10 Main Inductor of the 5-V Buck L2 Worst Case at 18 VIN, 63°C