TIDT279 October   2022

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Test Prerequisites
    1. 1.1 Power and Load Connections and Test Points
    2. 1.2 Voltage and Current Requirements
    3. 1.3 Required Equipment
    4. 1.4 Considerations
    5. 1.5 Board Dimensions
  5. 2Testing and Results
    1. 2.1 Efficiency and Loss Graphs
    2. 2.2 Thermal Images
    3. 2.3 Bode Plots
    4. 2.4 Conducted Emissions vs CISPR Class 5
  6. 3Waveforms
    1. 3.1 Output Voltage Ripple
    2. 3.2 Load Transients
    3. 3.3 Start-Up of Each Independently-Controlled Output

1.1 Power and Load Connections and Test Points

Table 1-1 describes power and load connections. Table 1-2 lists the test point descriptions and devices.

Table 1-1 Power and Load Connections
ConnectionsDescription
J-BATVIN to LM5127-Q1 three-output power supply
9-V to 18-V steady state main power input 2 × 1 5.08-mm terminal block
J8 and J8R8-V, 600-mA SEPIC output, 2 × Keystone 1212-ST (0.187 in [4.75 mm]
Quick-connect male solder connector non-insulated)
J5 and J5R5-V, 120-mA buck output, 2 × Keystone 1212-ST
J3 and J3R3.3-V, 6.7-A buck output, 2 × Keystone 1212-ST
Table 1-2 Test Points
Test PointDescriptionDevice
SP88-V output senseMCX jack receptacle
TP801Bode plot injection point for the 8-V loop
TP1Active low when any output active
J55Jumper to disable 5 VTSW-102-07-G-S
J33Jumper to disable 3.3 VTSW-102-07-G-S
SP55-V output sense

MCX jack receptacle

TP501Bode plot injection point for the 5-V loop
SP33.3-V output sense MCX jack receptacle
TP301Bode plot injection point for the 3.3-V loop
J300Dynamic current monitor off the 3.3-V dynamic loadReceptacle, ultra miniature coaxial, male pin, 50-Ω, SMT
J301Signal generator injection for the 3.3-V dynamic load

TSW-102-07-G-S

J302Not used, was to change 3.3-V loop speed

Figure 1-1 shows the test setup.

GUID-20220913-SS0I-B45Z-4JLQ-0FPS561TJRJW-low.jpgFigure 1-1 Test Setup for Conducted Emissions