TIDT293 October   2022

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Design Variants
  5. 2Design Overview
    1. 2.1 Board Contents
    2. 2.2 Connector Description
    3. 2.3 User Interface
      1. 2.3.1 Switches and Push-buttons
      2. 2.3.2 Jumpers
      3. 2.3.3 Potentiometers
    4. 2.4 Functional Block Diagram
    5. 2.5 Functional Block Descriptions
  6. 3Features and Performance Curves
    1. 3.1  Test Setup
    2. 3.2  Pulse
    3. 3.3  Levels and Free Run
    4. 3.4  INP
    5. 3.5  Dual-Output Power Supply
    6. 3.6  Overtemperature Protection
    7. 3.7  Slew Rate Adjust
    8. 3.8  Settling Time Adjust
    9. 3.9  Low- and High-Level Adjust
    10. 3.10 Pulse-Width Adjust
    11. 3.11 Period and Delay Adjust
    12. 3.12 Frequency Response
  7. 4Operation
    1. 4.1 Initial Setup – Jumper Selection and Potentiometer Settings
    2. 4.2 Procedure
      1. 4.2.1 Initial Power Up
      2. 4.2.2 Connecting the Circuit Under Test
  8. 5Limitations and Capabilities
    1. 5.1 Wiring Inductance
    2. 5.2 Minimum Voltage
    3. 5.3 Battery Life
  9. 6Typical Failure Mechanism
    1. 6.1 Fast Thermal Failure
    2. 6.2 Slow Thermal Failure

2.1 Board Contents

GUID-20220531-SS0I-DGNX-LKRQ-DTNQDGWNZVLX-low.png Figure 2-1 Board Subcircuits

The board consists of the following subcircuits:

  • A dual output power supply to provide power for the pulse shaping and driver circuits
  • A 5-V bias regulator to provide power for the timing circuits
  • A battery monitor with status LEDs to indicate good or low battery
  • An overtemperature protection circuit that provides thermal shutdown
  • A driver and load switch circuit for the load transient
  • A pulse shaping circuit that adjusts the low and high level of the load transient as well as the slew rate and settling time
  • Timing circuits that set the period, delay, and pulse width adjustments