TIDT293
October 2022
Description
Features
Applications
1
Design Variants
2
Design Overview
2.1
Board Contents
2.2
Connector Description
2.3
User Interface
2.3.1
Switches and Push-buttons
2.3.2
Jumpers
2.3.3
Potentiometers
2.4
Functional Block Diagram
2.5
Functional Block Descriptions
3
Features and Performance Curves
3.1
Test Setup
3.2
Pulse
3.3
Levels and Free Run
3.4
INP
3.5
Dual-Output Power Supply
3.6
Overtemperature Protection
3.7
Slew Rate Adjust
3.8
Settling Time Adjust
3.9
Low- and High-Level Adjust
3.10
Pulse-Width Adjust
3.11
Period and Delay Adjust
3.12
Frequency Response
4
Operation
4.1
Initial Setup – Jumper Selection and Potentiometer Settings
4.2
Procedure
4.2.1
Initial Power Up
4.2.2
Connecting the Circuit Under Test
5
Limitations and Capabilities
5.1
Wiring Inductance
5.2
Minimum Voltage
5.3
Battery Life
6
Typical Failure Mechanism
6.1
Fast Thermal Failure
6.2
Slow Thermal Failure
4.2.2
Connecting the Circuit Under Test
Turn off
Power (S1)
Connect the circuit under test to the
Vout_Load (J2)
and
GND_Load (J3)
terminals
Turn on
Power (S1)
Monitor current into
Vout_Load (J2)
and the voltage across the circuit under test
Adjust all levels and slew rates as desired observing MOSFET
(Q2)
SOA limitations