TIDT293 October   2022

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Design Variants
  5. 2Design Overview
    1. 2.1 Board Contents
    2. 2.2 Connector Description
    3. 2.3 User Interface
      1. 2.3.1 Switches and Push-buttons
      2. 2.3.2 Jumpers
      3. 2.3.3 Potentiometers
    4. 2.4 Functional Block Diagram
    5. 2.5 Functional Block Descriptions
  6. 3Features and Performance Curves
    1. 3.1  Test Setup
    2. 3.2  Pulse
    3. 3.3  Levels and Free Run
    4. 3.4  INP
    5. 3.5  Dual-Output Power Supply
    6. 3.6  Overtemperature Protection
    7. 3.7  Slew Rate Adjust
    8. 3.8  Settling Time Adjust
    9. 3.9  Low- and High-Level Adjust
    10. 3.10 Pulse-Width Adjust
    11. 3.11 Period and Delay Adjust
    12. 3.12 Frequency Response
  7. 4Operation
    1. 4.1 Initial Setup – Jumper Selection and Potentiometer Settings
    2. 4.2 Procedure
      1. 4.2.1 Initial Power Up
      2. 4.2.2 Connecting the Circuit Under Test
  8. 5Limitations and Capabilities
    1. 5.1 Wiring Inductance
    2. 5.2 Minimum Voltage
    3. 5.3 Battery Life
  9. 6Typical Failure Mechanism
    1. 6.1 Fast Thermal Failure
    2. 6.2 Slow Thermal Failure

6.2 Slow Thermal Failure

Slow thermal failure occurs when the FET internal junction exceeds the FET rating without tripping temperature protection. This can occur when using a fan to cool the board. In this case, the temperature sensor remained cooled, while the MOSFET still heats internally. Generally, the FET (Q2) shorts and the sense resistor (R21) opens. Cooling the load step board with a fan is not recommended.