TIDT318 January   2023

 

  1.   Description
  2.   Features
  3.   Applications
  4. 1Test Prerequisites
    1. 1.1 Voltage and Current Requirements
    2. 1.2 Required Equipment
    3. 1.3 Considerations
    4. 1.4 Dimensions
    5. 1.5 Test Setup
  5. 2Testing and Results
    1. 2.1 Efficiency Graphs
    2. 2.2 Thermal Images
    3. 2.3 Bode Plots
  6. 3Waveforms
    1. 3.1 Switching
    2. 3.2 Load Transients

Thermal Images

The first two thermal images in this section were taken with a load of 60 A, 14 VIN with a fan.

Figure 2-3 and Figure 2-4 show the thermal images of the board in phase 1 (Figure 2-3), followed by phase 2 (Figure 2-4). In these images, both low-side FETs and main inductors each had about a 40°C rise from the ambient room temperature of 21°C to 23°C.

GUID-20221208-SS0I-ZQLH-H5KW-W5HHHXZ5K9G0-low.jpgFigure 2-3 Phase 1 With Fan
GUID-20221208-SS0I-HZZV-FQFB-QHV4PJR3SHBR-low.jpgFigure 2-4 Phase 2 With Fan

The thermal images in Figure 2-5 and Figure 2-6 are for the same 14 VIN, but no fan was used and the load was 45 A. Here, phase 2 (Figure 2-6) was slightly hotter than phase 1 (Figure 2-5) with the inductor reaching 100°C, and the low-side FET reaching 96°C from the same ambient room temperature of 21°C to 23°C.

GUID-20221208-SS0I-6MXH-FZZC-1SM8XGQGF8CD-low.jpgFigure 2-5 Phase 1 With No Fan
GUID-20221208-SS0I-2WTF-KKVR-1T5FM6TTLCZF-low.jpgFigure 2-6 Phase 2 With No Fan