TIDUBE1D January   2016  – August 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products and Key Advantages
      1. 2.2.1 UCC28180 – PFC Controller
      2. 2.2.2 UCC27524 – Dual Low-Side Gate Driver
      3. 2.2.3 UCC28881 – 700-V Off-Line Converter
    3. 2.3 System Design Theory
      1. 2.3.1 Selecting Switching Frequency
      2. 2.3.2 Calculating Output Capacitance
      3. 2.3.3 Calculating PFC Choke Inductor
      4. 2.3.4 Selecting Switching Element
      5. 2.3.5 Boost Follower Control Circuit
      6. 2.3.6 Bias Power
      7. 2.3.7 On-Off Switch
      8. 2.3.8 Thermal Design
  9. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Required Hardware
      1. 3.1.1 Test Conditions
      2. 3.1.2 Recommended Equipment
      3. 3.1.3 Procedure
    2. 3.2 Test Results
      1. 3.2.1 Performance Data
        1. 3.2.1.1 Efficiency and iTHD
        2. 3.2.1.2 Standby Power and Output Voltage
      2. 3.2.2 Performance Curves
        1. 3.2.2.1 Efficiency Curve
        2. 3.2.2.2 Voltage Follower Performance
      3. 3.2.3 Functional Waveforms
        1. 3.2.3.1 Power On Sequence
        2. 3.2.3.2 Inrush Current Protection
        3. 3.2.3.3 Switching Node
        4. 3.2.3.4 Waveform Under 3.5kW, 230VAC
      4. 3.2.4 Thermal Measurements
  10. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
  11. 5Documentation Support
  12. 6Trademarks
  13. 7About the Author
  14. 8Revision History

2.3.8 Thermal Design

This reference is designed with a heatsink, section size is 146×22mm, 200mm length. Diode bridge BR1, MOSFET Q1, Q6, power diode D1, D3 are mounted on heatsink. Make sure use grease between BR1 to heatsink to improve thermal resistance, and use thermal pad between MOSFET/DIODE to heatsink for thermal conduction and also insulation.