Figure 3-1 shows an overview of a typical dual motor control with PFC system running from AC
power. The PFC stage enables wave shaping of the input AC current and provides the
adjustable DC power for 3-phase inverter for compressor and fan motors drive.
Figure 3-1 Hardware Board Block Diagram of TIDM-02010
The motor control board has functional groups that
enable a complete motor drive system. The following is a list of the blocks on the
board and their functions, Figure 3-2 shows the top view of the board and different blocks of the TIDM-02010 PCB.
Power line input filter
Dual common mode filter with cut-off frequency is 2.2 kHz.
Digital interleaved PFC
The maximum power is up to 1.5 kW.
Two phase interleaved boost PFC with 72 kHz switching frequency
Power MOSFET with UCC27517A high-speed gate drivers
3-phase inverter for motor_1 (Compressor)
Up to 1.5 kW 3-phase inverter supports PMSM or IPM
6 kHz switching frequency
3-shunt for current sensing
3-phase inverter for motor_2 (Fan)
Up to 150 W 3-phase inverter supports PMSM or IPM
12 kHz or 18 kHz switching frequency
3-shunt for current sensing
Control
Single TMS320F280025C or TMS320F28039C series MCU in 64-pin LQFP package
100 MHz 32-bit CPU with FPU and TMU
Amplify and input filters for the analog signals
Valve and relay drive for system function
Relay drive for AC valve
Stepper motor drive for electronic expansion valve
Auxiliary power supply
On-board power supply +3.3 V, +12 V, and +15 V
Figure 3-2 The Layout of Dual Motor Control with PFC Reference Design Board
Note:
F28002x, F28003x, and F280013x are fully pin to pin compatible on this 64-pin package, so the same PCB board can be used for one of these three MCUs.
TI recommends taking the following precautions when using the board:
Do not touch any part of the board or components connected to the board when the board is energized.
Use the AC Mains/wall power supply to power the kit. TI recommends an isolation AC source.
Do not touch any part of the board, the kit or its assembly when energized. (Though the power module heat sink is isolated from the board, high-voltage switching generates some capacitive coupled voltages over the heat sink body.)