TIDUEJ6A January   2019  – July 2022

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Flow Measurement
      2. 2.2.2 ToF Measurement
        1. 2.2.2.1 ADC-Based Acquisition Process
        2. 2.2.2.2 Ultrasonic Sensing Flow-Metering Library
      3. 2.2.3 Low-Power Design
        1. 2.2.3.1 Energy-Efficient Software
        2. 2.2.3.2 Optimized Hardware Design
        3. 2.2.3.3 Efficient Use of FRAM
        4. 2.2.3.4 The LEA Advantage
    3. 2.3 Highlighted Products
      1. 2.3.1 MSP430FR6043
      2. 2.3.2 OPA836 and OPA838
      3. 2.3.3 TS5A9411
    4. 2.4 System Design Theory
      1. 2.4.1 Signal Processing for ToF
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
        1. 3.1.1.1 EVM430-FR6043
      2. 3.1.2 Software
        1. 3.1.2.1 MSP Driver Library (MSP DriverLib)
        2. 3.1.2.2 Ultrasonic Sensing Flow Metering Library
        3. 3.1.2.3 Application
          1. 3.1.2.3.1 Application Customization
          2. 3.1.2.3.2 LCD Stand-Alone Mode
        4. 3.1.2.4 USS Design Center (PC GUI)
      3. 3.1.3 Transducer and Meter
        1. 3.1.3.1 Frequency Characterization of Transducer and Meter
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
        1. 3.2.1.1 Connecting Hardware
        2. 3.2.1.2 Building and Loading Software
          1. 3.2.1.2.1 Using Code Composer Studio IDE
          2. 3.2.1.2.2 Using IAR Embedded Workbench IDE
        3. 3.2.1.3 Executing Application
        4. 3.2.1.4 Configure Device and Observe Results Using GUI
        5. 3.2.1.5 Customization and Optimization
      2. 3.2.2 Test Results
        1. 3.2.2.1 Single-Shot Standard Deviation
        2. 3.2.2.2 Zero-Flow Drift
        3. 3.2.2.3 Absolute Time of Flight Measurements
        4. 3.2.2.4 Variability in Zero Flow Drift Across Transducers
        5. 3.2.2.5 Flow Measurements
        6. 3.2.2.6 Average Current Consumption
        7. 3.2.2.7 Memory Footprint
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
      6. 4.1.6 Assembly Drawings
    2. 4.2 Software Files
    3. 4.3 Related Documentation
    4. 4.4 Terminology
    5. 4.5 Trademarks
    6. 4.6 Support Resources
  10. 5About the Authors
  11. 6Revision History

4.1.2 Bill of Materials

To download the bill of materials (BOM), see the design files at TIDM-02003.