TIDUES0E June   2019  – April 2024 TMS320F28P550SJ , TMS320F28P559SJ-Q1

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1  UCC21710
      2. 2.2.2  UCC14141-Q1
      3. 2.2.3  AMC1311
      4. 2.2.4  AMC1302
      5. 2.2.5  OPA320
      6. 2.2.6  AMC1306M05
      7. 2.2.7  AMC1336
      8. 2.2.8  TMCS1133
      9. 2.2.9  TMS320F280039C
      10. 2.2.10 TLVM13620
      11. 2.2.11 ISOW1044
      12. 2.2.12 TPS2640
    3. 2.3 System Design Theory
      1. 2.3.1 Dual Active Bridge Analogy With Power Systems
      2. 2.3.2 Dual-Active Bridge – Switching Sequence
      3. 2.3.3 Dual-Active Bridge – Zero Voltage Switching (ZVS)
      4. 2.3.4 Dual-Active Bridge - Design Considerations
        1. 2.3.4.1 Leakage Inductor
        2. 2.3.4.2 Soft Switching Range
        3. 2.3.4.3 Effect of Inductance on Current
        4. 2.3.4.4 Phase Shift
        5. 2.3.4.5 Capacitor Selection
          1. 2.3.4.5.1 DC-Blocking Capacitors
        6. 2.3.4.6 Switching Frequency
        7. 2.3.4.7 Transformer Selection
        8. 2.3.4.8 SiC MOSFET Selection
      5. 2.3.5 Loss Analysis
        1. 2.3.5.1 SiC MOSFET and Diode Losses
        2. 2.3.5.2 Transformer Losses
        3. 2.3.5.3 Inductor Losses
        4. 2.3.5.4 Gate Driver Losses
        5. 2.3.5.5 Efficiency
        6. 2.3.5.6 Thermal Considerations
  9. 3Circuit Description
    1. 3.1 Power Stage
    2. 3.2 DC Voltage Sensing
      1. 3.2.1 Primary DC Voltage Sensing
      2. 3.2.2 Secondary DC Voltage Sensing
        1. 3.2.2.1 Secondary Side Battery Voltage Sensing
    3. 3.3 Current Sensing
    4. 3.4 Power Architecture
      1. 3.4.1 Auxiliary Power Supply
      2. 3.4.2 Gate Driver Bias Power Supply
      3. 3.4.3 Isolated Power Supply for Sense Circuits
    5. 3.5 Gate Driver Circuit
    6. 3.6 Additional Circuitry
    7. 3.7 Simulation
      1. 3.7.1 Setup
      2. 3.7.2 Running Simulations
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Required Hardware and Software
      1. 4.1.1 Hardware
      2. 4.1.2 Software
        1. 4.1.2.1 Getting Started With Software
        2. 4.1.2.2 Pin Configuration
        3. 4.1.2.3 PWM Configuration
        4. 4.1.2.4 High-Resolution Phase Shift Configuration
        5. 4.1.2.5 ADC Configuration
        6. 4.1.2.6 ISR Structure
    2. 4.2 Test Setup
    3. 4.3 PowerSUITE GUI
    4. 4.4 LABs
      1. 4.4.1 Lab 1
      2. 4.4.2 Lab 2
      3. 4.4.3 Lab 3
      4. 4.4.4 Lab 4
      5. 4.4.5 Lab 5
      6. 4.4.6 Lab 6
      7. 4.4.7 Lab 7
    5. 4.5 Test Results
      1. 4.5.1 Closed-Loop Performance
  11. 5Design Files
    1. 5.1 Schematics
    2. 5.2 Bill of Materials
    3. 5.3 Altium Project
    4. 5.4 Gerber Files
    5. 5.5 Assembly Drawings
  12. 6Related Documentation
    1. 6.1 Trademarks
  13. 7Terminology
  14. 8About the Author
  15. 9Revision History

3.5 Gate Driver Circuit

The UCC21710 is used as a gate driver. This device was selected for the integrated features for SiC, like DESAT protection, internal active Miller clamp and soft turn-off. The PWM interlock makes sure that at no time both complimentary PWMs of on H-Bridge are turned on. The analog-to-PWM channel, can be used for isolated temperature sensing on the high side. The DESAT voltage was configured to 6.4 V with a blanking time of 1 μs using the UCC217xx XL Calculator Tool available in the device product folder. The undervoltage lockout function of UCC21710 is used to check if both the isolated power (VCC ) and the non isolated power (VCC) are in a valid range which is indicated on the RDY pin.

TIDA-010054 UCC21710 Gate Drive CircuitFigure 3-13 UCC21710 Gate Drive Circuit