TIDUEX2 July   2020

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TPS62864
      2. 2.3.2 TPS62088
      3. 2.3.3 TLV73318
    4. 2.4 System Design Theory
      1. 2.4.1 Designing Buck Converter Circuit TPS62864
      2. 2.4.2 Designing Buck Converter Circuit TPS62088
      3. 2.4.3 Designing Buck Converter Circuit TLV73318
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Testing and Results
      1. 3.1.1 Test Setup
      2. 3.1.2 Test Results
        1. 3.1.2.1 Startup with no load
        2. 3.1.2.2 Load Transient Rail SoC 0.9V
        3. 3.1.2.3 Load Transient Rail NAND I/O 1.2 V
        4. 3.1.2.4 Load Transient Rail NAND VCC 2.5 V
        5. 3.1.2.5 Output Ripple Rail SoC 0.9 V
        6. 3.1.2.6 Output Ripple Rail NAND I/O 1.2 V
        7. 3.1.2.7 Output Ripple Rail NAND VCC 2.5 V
        8. 3.1.2.8 Output Ripple Rail SOC I/O 1.8 V
        9. 3.1.2.9 Efficiency
  9. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
      1. 4.3.1 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
  10. 5Software Files
  11. 6Related Documentation
    1. 6.1 Trademarks
    2. 6.2 Third-Party Products Disclaimer

3.1.2.9 Efficiency

GUID-5ABEB8AE-C76E-4206-AD0B-5D7C4CC37C27-low.pngFigure 3-9 Efficiency

The thermal measurements were done with the following parameters:

  • SoC 0.9 V – 2.0 A
  • NAND I/O 1.2 V – 1.3 A
  • NAND VCC 2.5 V – 1.7 A
  • SOC I/O 1.8 V – 10mA

The measurements were taken after the device has been working with this load for an hour.

GUID-C3FCA9C7-68CD-4E8E-87E0-A2983D335BE5-low.jpgFigure 3-10 Vin = 3.3 V, Iin = 2.452 A