TIDUEY6 April   2021

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 C2000 MCU F2838x
      2. 2.3.2 UCC5870-Q1 Gate Driver
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Hardware Overview
        1. 3.1.1.1 Control Module
          1. 3.1.1.1.1 Control Mother Board
            1. 3.1.1.1.1.1 Inverter Safing - UCC5870 ASC and Fault Control
            2. 3.1.1.1.1.2 DC-DC Safing
            3. 3.1.1.1.1.3 DC-DC Converter Secondary PWM Selection
            4. 3.1.1.1.1.4 Blower Fan Control
            5. 3.1.1.1.1.5 Voltage Monitor
            6. 3.1.1.1.1.6 Resolver Interface Control
            7. 3.1.1.1.1.7 Test Points on Control Module
            8. 3.1.1.1.1.8 General Purpose Ports
            9. 3.1.1.1.1.9 Connectors and Headers on Control Mother Board
          2. 3.1.1.1.2 Power Supplies
            1. 3.1.1.1.2.1 Power Supply 5V /5A
            2. 3.1.1.1.2.2 Power Supply 12-V/1-A
            3. 3.1.1.1.2.3 Power Supply 15-V/0.5-A
          3. 3.1.1.1.3 TCAN4550 module
          4. 3.1.1.1.4 Dual TCAN Module
          5. 3.1.1.1.5 Analog Back End Module
          6. 3.1.1.1.6 Resolver Analog Front End Module
        2. 3.1.1.2 Inverter Module
          1. 3.1.1.2.1 Inverter Mother Board
            1. 3.1.1.2.1.1 Connectors and Headers on Inverter Mother Board
            2. 3.1.1.2.1.2 Jumper and Test Points on Inverter Module
          2. 3.1.1.2.2 Inverter Gate Driver Module
            1. 3.1.1.2.2.1 Inverter Gate Drive Power Supply Module
          3. 3.1.1.2.3 Inverter Current Sense Module
          4. 3.1.1.2.4 Inverter Voltage Sense Module
        3. 3.1.1.3 DC-DC Bidirectional Converter Module
          1. 3.1.1.3.1 DC-DC Converter Mother Board
          2. 3.1.1.3.2 DC-DC Gate Driver Module
    2. 3.2 Resource Mapping
    3. 3.3 Test Setup
    4. 3.4 Test Results
  9. 4General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  11. 6About the Author
3.1.1.2.1.2 Jumper and Test Points on Inverter Module

Some test points are provided on the inverter module for debug purposes, especially on all gate drive pins of the SiC inverter power module. While some other test points are used to make connections between them, essentially acting as jumper points.

Table 3-3 Jumper Points Table
Jumper Points Purpose
TP1 and TP2 Connecting DC bus voltage Vdc to gate driver module to facilitate protection of high side switches by gate driver UCC5870
TP3 and TP7 Connecting isolated 15V + for phase A. Needed to feed hot side power supply for isolated current sensing of phase A
TP4 and TP8 Connecting isolated 15V - for phase A *
TP5 and TP6 Connecting isolated 15V + for phase B. Needed to feed hot side power supply for isolated current sensing of phase B
TP11 and TP12 Connecting isolated 15V - for phase B *

TP9 and TP10

 Connecting isolated 15V + for phase C. Needed to feed hot side power supply for isolated current sensing of phase C
TP13 and TP14 Connecting isolated 15V - for phase C *
Table 3-4 Test Points Table
Test Points Signal Name
TP15 and TP16 Gate and Source respectively of switch AH
TP17 and TP18 Gate and Source respectively of switch BH
TP19 and TP20 Gate and Source respectively of switch CH
TP21 and TP22 Gate and Source respectively of switch AL
TP23 and TP24 Gate and Source respectively of switch BL
TP25 and TP26 Gate and Source respectively of switch CL