TIDUEY8 March   2023

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Design Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 LMK04832-SP
      2. 2.2.2 LMX2615-SP
      3. 2.2.3 CDCLVP111-SP
      4. 2.2.4 ADC12DJ3200QML-SP
    3. 2.3 Design Steps
      1. 2.3.1 Multiple JESD204B Synchronization Requirements
      2. 2.3.2 Clock Tree Design
        1. 2.3.2.1 Clock Frequency Plan
        2. 2.3.2.2 Clock Tree Components
          1. 2.3.2.2.1 Clock Reference
          2. 2.3.2.2.2 Clock Reference Buffer
          3. 2.3.2.2.3 Clock Distribution
          4. 2.3.2.2.4 Frequency Synthesis
        3. 2.3.2.3 Phase Delay Adjustment Options
        4. 2.3.2.4 Phase-Noise Optimization
        5. 2.3.2.5 Single-Event Effects (SEE) Considerations
        6. 2.3.2.6 Expanding Clock Tree for MIMO Systems
      3. 2.3.3 Power Management
        1. 2.3.3.1 Power Design Considerations
        2. 2.3.3.2 Radiation Hardened (Rad-Hard) Power Tree
          1. 2.3.3.2.1 Radiation-Hardness-Assured (RHA) Load-Switches
          2. 2.3.3.2.2 Radiation-Hardness-Assured (RHA) DC/DC Buck Converter
          3. 2.3.3.2.3 Radiation-Hardness-Assured (RHA) Low-Dropout (LDO) Regulators
            1. 2.3.3.2.3.1 3.3-V Linear Regulator
            2. 2.3.3.2.3.2 4.5-V Linear Regulator
        3. 2.3.3.3 Overcurrent Detection Circuit
  8. 3Getting Started Hardware and Software
    1. 3.1 Hardware Configuration
      1. 3.1.1 Clocking Board Setup
        1. 3.1.1.1 Power Supply
        2. 3.1.1.2 Input Reference Signals
        3. 3.1.1.3 Input sync Signal
        4. 3.1.1.4 Output Signals
        5. 3.1.1.5 Programming Interface
        6. 3.1.1.6 FMC+ Adapter Board Setup
        7. 3.1.1.7 ADC12DJ3200 EVM Setup
        8. 3.1.1.8 TSW14J57EVM Setup
        9. 3.1.1.9 Multichannel Synchronization Setup
    2. 3.2 Software
      1. 3.2.1 Software Required
      2. 3.2.2 Clocking Board Programming Sequence
      3. 3.2.3 ADC12DJ3200CVAL EVM Programming Sequence
      4. 3.2.4 TSW14J57EVM Evaluation Programming Sequence
  9. 4Testing and Results
    1. 4.1 Test Setup
    2. 4.2 Results
      1. 4.2.1 Phase Noise Measurement Results
      2. 4.2.2 Multichannel Clock Phase Alignment
      3. 4.2.3 Signal Chain Performance
      4. 4.2.4 Channel-to-Channel Skew Measurement
    3. 4.3 Summary and Conclusion
  10. 5Design and Documentation Support
    1. 5.1 Design Support
      1. 5.1.1 Schematics
      2. 5.1.2 Bill of Materials
    2. 5.2 Documentation Support
    3. 5.3 Support Resources
    4. 5.4 Trademarks
  11. 6About the Authors
    1. 6.1 Acknowledgments

3.1.1.4 Output Signals

The following list describes the output signal connectors:

  • RFoutAP1, RFoutAM1, RFoutAP2, and RFoutAM2 connectors generate the DCLK and are connected to the phase-noise analyzer to measure phase noise and are connected to ADC EVMs as external clocks and measure SNR
  • RFoutBP1, RFoutBM1, RFoutBP2, and RFoutBM2 connectors generate the low-frequency SYSREF signals interface with ADC EVMs
  • Connectors J32 and J33 generates the FPGA CLKs and SYSREFs for two TSW14J57 capture cards