TIDUEY9 April   2021

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 LP8770
        1. 2.3.1.1 Safety Features
          1. 2.3.1.1.1 Window Watchdog
          2. 2.3.1.1.2 Voltage Monitoring
      2. 2.3.2 AWR1843/xWR6843 mmWave Sensor Solution
    4. 2.4 System Design
      1. 2.4.1 Hardware Block Diagram
      2. 2.4.2 Software Components
        1. 2.4.2.1 Secondary Bootloader (SBL)
        2. 2.4.2.2 mmWaveLink APIs
        3. 2.4.2.3 mmWave Safety Diagnostic Library (SDL)
        4. 2.4.2.4 mmWave SDK Software Block Diagram
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  10. 5About the Author

2 System Overview

TI’s radar mmWave integrated chips (ICs) include hardware and firmware elements to enable monitoring of its mmWave, analog and digital sections. Most of digital elements of device have built in diagnostic capability.

GUID-20210225-CA0I-1KCW-TMDH-CZ428B4VBBRF-low.gif Figure 2-1 mmWave Sensor Monitor & Diagnostic

Analog Subsystem contains the RF and Analog functionality of the device. It has two/three transmitters and four Receiver chains along with the Clock oscillator and FMCW signal generation circuitry (Cleanup APLL, Synthesizer, frequency multipliers etc.). Radar Subsystem is responsible for initializing and calibrating the Analog/RF modules. Also it periodically monitors the Analog/RF functionality to ensure all the Analog/RF modules work in their defined limits. This functionality can be configured through mmwavelink Monitoring APIs by MSS/DSS application with various mode and reporting options.

TOP, Master, and DSP subsystem contain various memory and digital components which have safety diagnostic features. These features can be configured and verified using Safety Diagnostic Library to manage both systematic and random faults of the device.

Figure 2-2 shows all the safety components of mmwave sensor device, which might differ for different device variants.

GUID-20210309-CA0I-01VN-SDWH-FQCGRXMXK3N0-low.gif Figure 2-2 mmWave Safety Components
Note: Refer to the mmWave Sensor Safety Manual for detailed information on these safety features.