TIDUF23 may   2023

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1  UCC5880-Q1
      2. 2.3.2  AM2634-Q1
      3. 2.3.3  TMS320F280039C-Q1
      4. 2.3.4  UCC14240-Q1
      5. 2.3.5  UCC12051-Q1
      6. 2.3.6  AMC3330-Q1
      7. 2.3.7  TCAN1462-Q1
      8. 2.3.8  ISO1042-Q1
      9. 2.3.9  ALM2403-Q1
      10. 2.3.10 LM5158-Q1
      11. 2.3.11 LM74202-Q1
    4. 2.4 System Design Theory
      1. 2.4.1 Microcontrollers
        1. 2.4.1.1 Microcontroller – C2000™
        2. 2.4.1.2 Microcontroller – Sitara™
      2. 2.4.2 Isolated Bias Supply
      3. 2.4.3 Power Tree
        1. 2.4.3.1 Introduction
        2. 2.4.3.2 Power Tree Block Diagram
        3. 2.4.3.3 12 V Distribution and Control
        4. 2.4.3.4 Gate Drive Supply
        5. 2.4.3.5 5-Volt Supply Domain
        6. 2.4.3.6 Current and Position Sensing Power
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Hardware Board Overview
        1. 3.1.1.1 Control Board
        2. 3.1.1.2 MCU Control Card – Sitara™
        3. 3.1.1.3 MCU Control Card – C2000™
        4. 3.1.1.4 Gate Driver and Bias Supply Board
        5. 3.1.1.5 DC Bus Voltage Sense
        6. 3.1.1.6 SiC Power Module
          1. 3.1.1.6.1 XM3 SiC Power Module
          2. 3.1.1.6.2 Module Power Terminals
          3. 3.1.1.6.3 Module Signal Terminals
          4. 3.1.1.6.4 Integrated NTC Temperature Sensor
        7. 3.1.1.7 Laminated Busing and DC Bus Capacitors
          1. 3.1.1.7.1 Discharge PCB
    2. 3.2 Test Setup
      1. 3.2.1 Software Setup
        1. 3.2.1.1 Code Composer Studio Project
        2. 3.2.1.2 Software Structure
    3. 3.3 Test Procedure
      1. 3.3.1 Project Setup
      2. 3.3.2 Running the Application
    4. 3.4 Test Results
      1. 3.4.1 Isolated Bias Supply
      2. 3.4.2 Isolated Gate Driver
      3. 3.4.3 Inverter System
  9. 4General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Layout Prints
      4. 5.1.4 Altium Project
      5. 5.1.5 Gerber Files
      6. 5.1.6 Assembly Drawings
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  11. 6Terminology

General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines

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Always follow TI’s setup and application instructions, including use of all interface components within their recommended electrical rated voltage and power limits. Always use electrical safety precautions to help ensure your personal safety and those working around you. Contact TI's Product Information Center for further information.

Save all warnings and instructions for future reference.

WARNING:

Failure to follow warnings and instructions can result in personal injury, property damage or death due to electrical shock and burn hazards.

The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed printed circuit board assembly. It is intended strictly for use in development laboratory environments, solely for qualified professional users having training, expertise and knowledge of electrical safety risks in development and application of high voltage electrical circuits. Any other use and/or application are strictly prohibited by Texas Instruments. If you are not suitable qualified, you should immediately stop from further use of the HV EVM.

  1. Work Area Safety
    1. Keep work area clean and orderly.
    2. Qualified observer(s) must be present anytime circuits are energized.
    3. Effective barriers and signage must be present in the area where the TI HV EVM and its interface electronics are energized, indicating operation of accessible high voltages may be present, for the purpose of protecting inadvertent access.
    4. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located within a protected Emergency Power Off EPO protected power strip.
    5. Use stable and non conductive work surface.
    6. Use adequately insulated clamps and wires to attach measurement probes and instruments. No freehand testing whenever possible.
  2. Electrical Safety
    As a precautionary measure, it is always a good engineering practice to assume that the entire EVM may have fully accessible and active high voltages.
    1. De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any electrical or other diagnostic measurements. Re-validate that TI HV EVM power has been safely de-energized.
    2. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring, measurement equipment connection, and other application needs, while still assuming the EVM circuit and measuring instruments are electrically live.
    3. After EVM readiness is complete, energize the EVM as intended.
    WARNING:

    While the EVM is energized, never touch the EVM or its electrical circuits, as they could be at high voltages capable of causing electrical shock hazard.

  3. Personal Safety
    1. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields) or protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.

Limitation for safe use:

EVMs are not to be used as all or part of a production unit.